A cable includes: a pair of core wires; an integrally extruded insulating layer covering the pair of core wires; a shielding layer covering the extruded insulating layer; and an outer insulating layer covering the shielding layer; wherein the pair of core wires are arranged longitudinally side by side and touch each other.

A copper alloy that does not contain beryllium and has a 0.2% offset yield strength of at least 80 ksi and an electrical conductivity of at least 48% IACS is disclosed. The copper alloy contains nickel, silicon, chromium, manganese, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used for example, as a heat sink.

A weld nugget portion that is obtained by welding a central conductor of a wire and a receiving portion of a metal terminal is formed on the receiving portion that receives an end portion of the wire with the weld nugget portion expanding from a surface of the receiving portion along which the wire is disposed. An area ratio of a blowhole to a section of the weld nugget portion that is along an imaginary cut plane that is perpendicular to the surface of the receiving portion along which the wire is disposed is no less than 0% and no more than 8.4% (i.e., from 0% to 8.4%), preferably no less than 0% and no more than 1.3% (i.e., from 0% to 1.3%). A central axis of the central conductor of the wire in the weld nugget portion extends along the imaginary cut plane.

The present invention provides a bonding wire for a semiconductor device, where the bonding wire can inhibit wear of capillary. In a Cu alloy bonding wire for a semiconductor device, a total of abundance ratios of a crystal orientations <110> and <111> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis is to crystal orientations on a wire surface 40% or more and 90% or less, in average area percentage.

A transparent conductor including a transparent substrate, a first dielectric layer, a metal layer containing silver or a silver alloy as a primary component, a second dielectric layer composed of a semiconductor, and a third dielectric layer of which electrical conductivity is different from that of the second dielectric layer in the order presented, wherein the third dielectric layer-is composed of a conductor.

A high frequency signal transmission cable includes a conductor, an insulator provided over a periphery of the conductor, a plating layer provided over a periphery of the insulator, and a sheath provided over a periphery of the plating layer. A crack suppressing layer includes a non-cross-linked polyethylene is provided between the insulator and the plating layer, in such a manner as to remain in contact with the insulator while being provided with the plating layer over an entire periphery of a roughened outer surface of the crack suppressing layer. The crack suppressing layer is unadhered to the insulator. The plating layer is adhered to the crack suppressing layer. The crack suppressing layer suppresses an occurrence of a cracking in the plating layer by bending together with the plating layer while being integral and moving with the plating layer in a longitudinal direction of the cable.

A power cord with leakage current detection function includes an insulated neutral wire and aluminum foil wrapping or surrounding the neutral wire insulator. The neutral wire aluminum foil has a conductive side and a non-conductive side, wherein the non-conductive side is adjacent to the outside of the neutral wire insulator and the conductive side is facing outwards. The power cord also includes an insulated line wire surrounded by aluminum foil where the conductive side is facing outwards and in contact with the conductive side of the aluminum foil surround the neutral wire. The power cord also includes a copper braid surrounding an insulated ground wire, wherein the copper braid is in simultaneous electrical contact with the conductive sides of the line and neutral aluminum foil wraps.

A coaxial cable includes an inner conductor; an insulator covering a circumference of the inner conductor; a shield layer covering a circumference of the insulator; and a sheath covering a circumference of the shield layer. The inner conductor is composed of first metal strands that are twisted each other in such a manner that a cross-sectional shape of the inner conductor is circular. The shield layer includes a winding shield layer including second metal strands spirally wound around the insulator, and a shield tape layer including a shield tape including a resin tape and a metal layer provided on one side of the resin tape, the shield tape being spirally wound around the winding shield layer with the metal layer being located inwardly radially in such a manner that the metal layer is being in contact with the winding shield layer. The winding shield layer has a gap in at least one location between the second metal strands adjacent to each other in a circumferential direction, and a sum of distances w between the second metal strands adjacent to each other via the gap is not more than an outer diameter d of the second metal strand in a cross-section perpendicular to a longitudinal direction.

A system and method for an LCDI power cord and associated circuits is provided. The system and method include energizing shielded neutral wires and shielded line wires and monitoring the energized shields for surges, e.g., arcing, detected by a Leakage Current Detection Circuit (LCDC) and/or voltage drops, e.g., shield breaks, detected by a Shield Integrity Circuit (SIC).

A system and method for an LCDI power cord and associated circuits is provided. The system and method include energizing shielded neutral wires and shielded line wires and monitoring the energized shields for surges, e.g., arcing, detected by a Leakage Current Detection Circuit (LCDC) and/or voltage drops, e.g., shield breaks, detected by a Shield Integrity Circuit (SIC).