In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

The present disclosure relates generally to wires and more particularly to textured powder wires containing nanoscale metallic silver powder. The invention presents an improvement of the process of making compressed cores of textured-powder high-temperature superconductor previously using the micaceous high-temperature superconductor Bi-2212. Embodiments of the claimed methods are useful with the micaceous high-temperature superconductors, notably Bi2Sr2CaCu208+x (Bi-2212) and Bi2Sr2Ca2Cu3O10+x (Bi-2223) and rare earth barium copper oxide (REBCO).

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

An improved thermocouple includes a drawn coaxial thermocouple wire pair having a more precise hot junction at which a first and second metallic material electrically connect with each other for measuring temperature. Adapted for use with an electrophysiologic catheter, the improved thermocouple comprising an elongated body having a proximal end and a distal end. The body includes a core of a first metallic material, a first coaxial layer of ceramic material, and a second coaxial layer of a second metallic material. The thermocouple further includes a solder cap on the distal end, the solder cap electrically connecting the core and the second layer at the distal end. A method of manufacturing includes drawing the body through a die, and applying solder on a distal end of the body to electrically connect the two metallic materials at the distal end.

The invention is a copper alloy with excellent comprehensive performance, including the following components in percentage by weight: 0.4 wt %-2.0 wt % of Ni, 0.2 wt %-2.5 wt % of Sn, 0.02 wt %-0.25 wt % of P, 0.001 wt %-0.5 wt % of Si, and the balance of Cu and unavoidable impurities. The copper alloy has a yield strength of 550 MPa or above, and an electrical conductivity of 38% IACS or above. A bending workability is as follows: the value of R/t in the GW direction is less than or equal to 1, and the value of R/t in the BW direction is less than or equal to 2; and after the copper alloy is kept at 150 C. for 1000 hours, a residual stress rate is greater than or equal to 75%, and the stress relaxation resistance is excellent.

A wire for an ignition coil assembly and/or a corona ignition assembly is provided. The wire comprises a wire core including a copper-based material, and a coating applied to the wire core. The coating includes at least one of a carbon-based material and magnetic nanoparticles. The carbon-based material can include graphene and/or carbon nanotubes, and the magnetic nanoparticles can include graphene and iron oxide (Fe.sub.3O.sub.4). Typically, the coating includes a plurality of layers. For example, the coating can include a layer of the graphene and/or carbon nanotubes, and/or a layer of the magnetic nanoparticles. The coating can also include a layer of insulating material, such as enamel. According to another embodiment, the coating includes iron, nickel, and/or cobalt plated onto the wire core.

A polymeric positive temperature coefficient (PPTC) device including a PPTC body, a first electrode disposed on a first side of the PPTC body, and a second electrode disposed on a second side of the PPTC body, wherein the PPTC body is formed of a PPTC material that includes a polymer matrix and a conductive filler, wherein the conductive filler defines 20%-39% by volume of the PPTC material.

The objective of the invention is to provide a wiring system by which it is possible to minimize size increases and reduced work efficiency during assembly even when using an aluminum wire or an aluminum alloy wire for at least a portion of a signal line. This wiring system includes a digital signal wire. This wiring system contains an aluminum wire or an aluminum alloy wire as the digital signal wire.

Provided are an electric wire conductor having both flexibility and a space-saving property, a covered electric wire, and a wiring harness containing such an electric wire conductor. The electric wire conductor contains a plurality of elemental wires, and has a flat portion in which a cross-section intersecting an axial direction of the wire strand has a flat shape. Deformation ratios of the elemental wires at peripheral end parts in a width direction are 70% or lower of deformation ratios of the elemental wires at center parts. Further, a covered electric wire contains the electric wire conductor and an insulator covering the electric wire conductor.

A method of the present invention includes preparing a substrate having a surface on which a electrode pad is formed, forming a resist layer on the substrate, the resist layer having an opening on the electrode pad, filling conductive paste in the opening of the resist layer; sintering the conductive paste in the opening to form a conductive layer which covers a side wall of the resist layer and a surface of the electrode pad in the opening, a space on the conductive layer leading to the upper end of the opening being formed, filling solder in the space on the conductive layer and removing the resist layer.