Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.

The invention relates to a system for producing Cu-Graphene composite wire that can replace copper cables used in transmission lines, electrical machines, transformers and households, and a method for said production system.

Provided is a Corson alloy having improved bending workability and also having high dimensional accuracy after press-working. A copper alloy strip which is a rolling material, the rolling material containing from 0 to 5.0% by mass of Ni or from 0 to 2.5% by mass of Co, the total amount of Ni+Co being from 0.2 to 5% by mass; from 0.2 to 1.5% by mass of Si, the balance being copper and unavoidable impurities, wherein the rolling material has a surface satisfying the relationship: 1.0≤I.sub.(200)/I.sub.0(200)≤5.0; wherein an area ratio of Cube orientation {100} <001> is from 2 to 10% in EBSD measurement of a rolling parallel cross section; and wherein a ratio: (an average crystal grain size of Cube orientation {100} <001> of the rolling parallel cross section)/(an average crystal grain size of the rolling parallel cross section) is from 0.75 to 1.5.

Provided is photo-sintering nano ink. The photo-sintering nano ink includes a photo-sintering precursor including a conductive nano particle and an oxide film surrounding the conductive nano particle, polymer binder resin, and an adhesive.

An electromagnetic protection sheath made of textile (10) is formed by conductive filaments extending in a first direction (X) and non-conductive filaments interlaced with the conductive filaments. Use in particular for shielding cables in aeronautical applications.

Described is a cable comprising a plurality of high temperature superconductor (HTS) components, a plurality of electrically conductive segments extending along a length of the cable, each of the plurality of electrically conductive segments comprising one of the plurality of HTS components, and an electrically insulating material arranged between adjacent ones of the plurality of electrically conductive segments.

A cable is composed of a cable core including one or more electric wires, a shield layer covering around the cable core, and a sheath covering around the shield layer. The shield layer includes a braided shield braided in such a manner that first metal wires composed of aluminum or an aluminum alloy intersect with second metal wires composed of copper or a copper alloy. An outer diameter of each of the second metal wires is larger than an outer diameter of each of the first metal wires.

Provided are a conductive film and a preparation method for the same, which relate to the technical field of conductive films. The preparation method for the conductive film includes: forming a metal process layer on a surface of an insulating layer by means of evaporation deposition, wet electroplating or chemical plating; forming a metal transition layer on a surface of the metal process layer facing away from the insulating layer by means of magnetron sputtering; and forming a metal functional layer on a surface of the metal transition layer facing away from the metal process layer. The conductive film obtained by this preparation method can have relatively good conductivity and density while having a relatively thick metal conductive layer.

The invention is a precipitation-strengthened copper alloy, including the following components in percentage by weight: 80 wt %-95 wt % of Cu, 0.05 wt %-4.0 wt % of Sn, 0.01 wt %-3.0 wt % of Ni, 0.01 wt %-1.0 wt % of Si, and the balance of Zn and unavoidable impurities. According to the invention, the comprehensive performance of the alloy is improved by solution strengthening and precipitation strengthening; while the strength of the matrix is improved, the electrical conductivity of the alloy is hardly affected, the bending workability meets the requirements, and the stress relaxation resistance comparable to that of tin phosphor bronze is achieved. The comprehensive performance of the alloy of the invention is superior to that of the tin phosphor bronze C51900. Furthermore, the alloy of the invention is low in raw material cost, has obvious advantages in welding and plating.