Embodiments of the present disclosure generally relate to a unitary electrical conduit that includes a central conductor, a socket coupled to a first end of the central conductor, a male insert coupled to a second end of the central conductor a dielectric sheath surrounding the central conductor, and an outer conductor surrounding the dielectric sheath, wherein a substantially 90 degree bend is formed along a length thereof.

Cables including conductors formed form ultra-conductive copper wires which have a lower temperature coefficient of resistance are disclosed. Methods of making the cables including conductors with ultra-conductive copper wires are further disclosed.

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

The present invention discloses a metal composite wire capable of increasing a tightness degree of copper-aluminum bonding. The metal composite wire includes a metal core rod. Continuous spiral grooves are formed in a surface of the core rod The core rod is cladded with a metal cladding layer with higher electrical conductivity than the core rod. An average depth of the continuous spiral grooves 1/10 of a thickness of the metal cladding layer. By setting the thickness of the metal cladding layer as t.sub.1, a specific gravity of the metal cladding layer as.sub.1, a diameter of the core rod as R, the average depth of the continuous spiral grooves as h, and a specific gravity of the core rod as .sub.2,

[00001]$t_1=\sqrt{\frac{{\left(R-h\right)}^2{}_1+k{\left(R-h\right)}^2{}_2-k{\left(R-h\right)}^2{}_1}{\left(1-k\right){}_1}}+h-R.Math..Math.\mathrm{and}$$0.2k0.7.$

The metal composite wire of the present invention can be widely applied to cable conductors and cable shielding braiding layers.

Provided is a Pd coated Cu bonding wire for a semiconductor device capable of sufficiently obtaining bonding reliability of a ball bonded portion in a high temperature environment of 175 C. or more, even when the content of sulfur in the mold resin used in the semiconductor device package increases.

The bonding wire for a semiconductor device comprises a Cu alloy core material; and a Pd coating layer formed on a surface of the Cu alloy core material; and contains 0.03 to 2% by mass in total of one or more elements selected from Ni, Rh, Ir and Pd in the bonding wire and further 0.002 to 3% by mass in total of one or more elements selected from Li, Sb, Fe, Cr, Co, Zn, Ca, Mg, Pt, Sc and Y. The bonding wire can be sufficiently obtained bonding reliability of a ball bonded portion in a high temperature environment of 175 C. or more, even when the content of sulfur in the mold resin used in the semiconductor device package increases by being used.

Various embodiments relate to an electrical feedthrough assembly an elongate conductor and a collar at least partially surrounding the elongate conductor along a portion of a length of the elongate conductor. The collar can be composed of a material having a thermal conductivity of at least 170 W/(m-K). A shell can be disposed around the collar. At one or more operating frequencies, at least a portion of a length of the electrical feedthrough assembly can be selected to provide at least one quarter wave transform.

A copper alloy sheet material contains, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg-1.18(PFe/3.6).sup.3 0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass %)/the Mg content of the alloy (mass %) 100 is 50% or more. The density of an FeP-based compound having a particle size of 50 nm or more is 10.00 particles/10 mm.sup.2 or less, and the density of an MgP-based compound having a particle size of 100 nm or more is 10.00 particles/10 mm.sup.2 or less. The CuFePMg-based copper alloy sheet material is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in a direction perpendicular to both a rolling direction and a sheet thickness direction.

An adhesive composition including resin and electro-conductive material, wherein the electro-conductive material is one or more salts from sodium salt, potassium salt, and calcium salt of fluorosulfonic acid having 5 or more carbon atoms shown by the general formula (1): (R.sup.1XYSO.sub.3.sup.).sub.nM.sup.n+(1), wherein, R.sup.1 represents a monovalent hydrocarbon group having 1-30 carbon atoms and optionally substituted by a heteroatom or optionally interposed by a heteroatom; X represents any of a single bond, ether group, ester group, and amide group; Y represents a linear or branched alkylene group having 2-4 carbon atoms, containing 1-6 fluorine atoms, and optionally containing a carbonyl group; M.sup.n+ represents any of a sodium ion, potassium ion, and calcium ion. This can form a living body contact layer for a bio-electrode with electric conductivity, biocompatibility, and light weight, which can be manufactured at low cost and without electric conductivity large lowering even when wetted with water or dried.

In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.

A conductor for power transportation comprises an elongated core constructed from a core material and an elongated conductive casing constructed from a conductive material. The elongated conductive casing is positioned around the elongated core and constructed from various layers of wires. Each layer of wires consists of a set of wires which are positioned next to each other, and at least a fraction of these wires being shaped in such a way that for the cross section of the wire. A circumscribed circle is filled only with between 50% and 90% of wire material. The cross section of the wire has a central portion filled with wire and a plurality of protrusions. The shape of these wires is such that the space taken up by these wires in the stack of wires in the layers is substantially cylindrical.