A solder bump structure includes a pillar formed on an electrode pad. The pillar has a concave curve-shaped surface and a geometry defined at least in part by dimensions including a first height greater than a first width. The solder bump structure further includes solder formed on the concave curve-shaped surface of the pillar. The solder has a convex top surface and having dimensions including a second height greater than a second width due to the geometry of the pillar.

Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.

This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.

A method for manufacturing an insulated conductive material, the method including providing a wire, applying a masking material to one or more regions of the wire, coating regions of the wire other than the one or more regions with an insulating material by, electrically charging the wire with a first charge polarity, providing a medium of electrically charged insulating material particles that are charged with an opposite polarity, passing the charged wire through the medium, whereby the insulating material particles bind areas of the conductive material other than the one or more regions, curing the insulating material particles, and applying a solvent to the masking material to thereby remove the masking material, wherein the cured insulated material particles are substantially unaffected by the solvent.

Ultra-conductive wires having enhanced electrical conductivity are disclosed. The conductivity of an ultra-conductive wire is enhanced using cold wire drawing and annealing. Methods of making the ultra-conductive wires are further disclosed.

An electromagnetic protection sheath made of textile (10) is formed by conductive filaments extending in a first direction (X) and non-conductive filaments interlaced with the conductive filaments. Use in particular for shielding cables in aeronautical applications.

In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.

A copper alloy for an electronic and electric device is provided. The copper alloy includes: Mg in a range of 0.15 mass % or more and less than 0.35 mass %; and a Cu balance including inevitable impurities, wherein the electrical conductivity of the copper alloy is more than 75% IACS, and a strength ratio TS.sub.TD/TS.sub.LD, which is calculated from strength TS.sub.TD obtained in a tensile test performed in a direction perpendicular to a rolling direction and strength TS.sub.LD obtained in a tensile test performed in a direction parallel to a rolling direction, is more than 0.9 and less than 1.1. The copper alloy may further include P in a range of 0.0005 mass % or more and less than 0.01 mass %.

A terminal block in which outflow of a sealing portion made of a rubber-based adhesive can be suppressed even when exposed to a heated environment, and the sealing properties can be maintained. The terminal block includes a housing having a resin portion, a bus bar, and the sealing portion. The bus bar integrally includes an embedded portion embedded in the resin portion, and a connecting portion projecting outward from the resin portion. The sealing portion fills a gap between the embedded portion and the resin portion. The sealing portion is made of a rubber-based adhesive. The bus bar includes a base material made of Cu or a Cu alloy, and an Sn-based plated layer made of Sn or an Sn alloy and partially covering a surface of the base material. The base material is exposed at a sealing region in contact with the sealing portion.

A wire cable comprising a ground conductor and an insulated conductor wherein the insulated conductor comprises a metal conductor, an insulated material surrounding the metal conductor, and a nylon jacket surrounding the insulated material. A binder surrounds the ground conductor and the insulated conductor and a jacket surrounds the binder.