The present invention provides a Cu alloy bonding wire for a semiconductor device, where the bonding wire can satisfy requirements of high-density LSI applications. In the Cu alloy bonding wire for a semiconductor device, the abundance ratio of a crystal orientation <110> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis to crystal orientations on a wire surface is 25% or more and 70% or less in average area percentage.

A terminal block in which outflow of a sealing portion made of a rubber-based adhesive can be suppressed even when exposed to a heated environment, and the sealing properties can be maintained. The terminal block includes a housing having a resin portion, a bus bar, and the sealing portion. The bus bar integrally includes an embedded portion embedded in the resin portion, and a connecting portion projecting outward from the resin portion. The sealing portion fills a gap between the embedded portion and the resin portion. The sealing portion is made of a rubber-based adhesive. The bus bar includes a base material made of Cu or a Cu alloy, and an Sn-based plated layer made of Sn or an Sn alloy and partially covering a surface of the base material. The base material is exposed at a sealing region in contact with the sealing portion.

A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.

Implementations of a battery pack with reduced magnetic field emission are provided. The battery pack is configured to reduce or eliminate the magnetic field normally generated while electrical current is being drawn from cylindrical-steel electrochemical cells (e.g., AA batteries) by a connected electrical device. In some implementations, a battery pack with reduced magnetic field emission comprises two or more electrochemical cells positioned in a coaxial configuration. In this coaxial configuration, the supply path is through the center of each electrochemical cell, and the return path is through a conductive sleeve positioned about each electrochemical cell of the battery pack. In this way, the supply path and the return path are as close as is physically possible, thereby minimizing any magnetic field generated between the conductors (i.e., between the electrochemical cells and their conductive sleeves). An insulating layer of material separates each cylindrical-steel electrochemical cell from the conductive sleeve positioned thereabout.

A multi-core cable for vehicle includes two power wires, two signal wires, two electric wires, and a sheath. The two power wires have the same size and are made of the same material. The two signal wires have the same size and are made of the same material, and a pair of the two signal wires is twisted and is configured a twisted pair of signal wires. The two electric wires have the same size and are made of the same material, and a pair of the electric wires is twisted and is configured as a twisted pair of electric wires. The two power wires, the twisted pair of signal wires and the twisted pair of electric wires are stranded.

Provided is a silver-coated copper powder which can be utilized as an electrically conductive paste and an electromagnetic wave shield. A silver-coated copper powder has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 m to 5.0 m to be determined by scanning electron microscopic (SEM) observation gather, the surface of the copper particles is coated with silver, the average particle diameter (D50) of the silver-coated copper powder 1 is from 1.0 m to 100 m, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.

An electric wire conductor having both flexibility and a space-saving property, a covered electric wire, and a wiring harness containing such an electric wire conductor. The electric wire conductor contains a plurality of elemental wires, and has a flat portion in which a cross-section intersecting an axial direction of the wire strand has a flat shape. In the cross-section of the flat portion, a vacancy ratio defined as a ratio of vacancies not occupied by the elemental wires is 17% or higher. Further, a covered electric wire contains the electric wire conductor and an insulator covering the electric wire conductor. Furthermore, a wiring harness contains the covered electric wire.

An insulated electric wire is composed of a conductor, and a covering layer disposed around an outer circumference of the conductor. The covering layer has a plurality of flame retardant layers composed of a flame retardant resin composition, and an insulating layer interposed between the plurality of flame retardant layers. The insulating layer is made of a resin composition including a resin component, and the resin component includes 40% by mass or more of a resin having a melting point of 125 degrees C. or higher of 100% by mass of the resin component.

A garment is provided prepared from a smart fabric, wherein the smart fabric contains: one or more devices providing satellite positioning measurement, accelerometer measurement, or both, conductively coupled to a battery or other DC power source, and in additional embodiments, the smart fabric contains a conductive composite yarn/sewing thread, wherein the conductive composite yarn/sewing thread has: a) a core formed of at least two strands of a conductive metal of 40 or higher gauge, wherein the at least two strands of conductive metal are configured such that one strand is wrapped around the other strand at a wrap rate of from 1 to 50 turns per inch (tpi); wherein the wrapped strand is preferably a ground wire, and b) at least one inner cover wrapped around the core in a first direction at a rate sufficient to provide substantially complete coverage of the core by the inner cover; c) at least one outer cover wrapped around the at least one inner cover, wherein the outer cover is wrapped in a second direction opposite to a direction of a cover layer on which the outer cover is directly wrapped, at a rate sufficient to provide substantially complete cover of the cover layer on which the outer cover is directly wrapped; and d) at least one bonding agent; and e) optionally, a lubricant, and optionally further including one or more biometric sensors.

A method of the present invention includes preparing a substrate having a surface on which a electrode pad is formed, forming a resist layer on the substrate, the resist layer having an opening on the electrode pad, filling conductive paste in the opening of the resist layer; sintering the conductive paste in the opening to form a conductive layer which covers a side wall of the resist layer and a surface of the electrode pad in the opening, a space on the conductive layer leading to the upper end of the opening being formed, filling solder in the space on the conductive layer and removing the resist layer.