This disclosure details exemplary battery pack designs for use in electrified vehicles. Exemplary battery arrays that may be incorporated into electrified vehicle battery packs may include a grouping of battery cells and a circuit connector module configured for electrically connecting the grouping of battery cells. The circuit connector module may include a first bus bar made of a single material and a second bus bar that is fusible and made of at least two dissimilar materials.

A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

Electrical connector includes a housing, signal contacts, and ground shields. The signal contacts are coupled to the housing and positioned for mating with mating signal contacts of a mating connector. The ground shields are coupled to the housing and at least partially surround the signal contacts to shield the signal contacts. The ground shields are plated with a ground-material composition along one or more contact segments of the ground shields that come into compression engagement with one or more other conductive members. The ground-material composition includes a tin-nickel (Sn/Ni) alloy plating layer. The signal contacts are plated with a signal-material composition that is different than the ground-material composition.

According to one embodiment, a plasma processing apparatus includes a chamber being possible to maintain an atmosphere more depressurized than atmospheric pressure, a plasma generator generating a plasma inside the chamber, a gas supplier supplying a gas into the chamber, a placement part positioned below a plasma generation region and placing a processed product thereon, a depressurization part depressurizing the chamber, and a power supply electrically connected to an electrode provided on the placement part via a bus bar. The bus bar is formed of an alloy of copper and gold. Gold is more included than copper on a surface side of the bus bar. The bus bar includes a first layer formed of copper and a second layer covering the first layer and formed of an alloy of copper and gold. Gold is more included than copper on a surface side of the second layer.

A method and composition for doped HTS tapes having directional flux pinning and critical current.

A method of the present invention includes preparing a substrate having a surface on which a electrode pad is formed, forming a resist layer on the substrate, the resist layer having an opening on the electrode pad, filling conductive paste in the opening of the resist layer; sintering the conductive paste in the opening to form a conductive layer which covers a side wall of the resist layer and a surface of the electrode pad in the opening, a space on the conductive layer leading to the upper end of the opening being formed, filling solder in the space on the conductive layer and removing the resist layer.

Connectors having contacts that can be highly corrosion resistant, can conserve precious materials, and can be readily manufactured. Examples can provide connector contacts that are highly corrosion resistant. These contacts can be formed of a precious metal or a precious-metal alloy. The precious-metal alloy can be a high-entropy alloy. To conserve the precious materials, a contact can be formed by a stamping a structure that becomes the contact, instead of stamping the contact from a structure. The structure can be a rod. To conserve the precious materials, only contacts that convey high voltages, such as power supplies, might be formed of the precious materials.

Provided is an anticorrosive containing a curable resin composition and that has a high anticorrosive capability and a good adhesion to an oily surface, and a terminal-attached covered electric wire and a wiring harness using the anticorrosive. The terminal-attached covered electric wire has a contact portion where a wire conductor of a covered electric wire and a connection terminal contact each other. The contact portion is covered with the anticorrosive. The wiring harness contains the terminal-attached covered electric wire. The curable resin composition contains 100 parts by mass of a polymer of a (meth)acrylate monomer, the polymer having two or more (meth)acrylate groups, 40 to 90 parts by mass of isobornyl (meth)acrylate, and 1 to 15 part by mass of an alkyl (meth)acrylate represented by formula 1, where R1 is either H or CH3, and R2 is an alkyl group having a carbon number of 8 to 13, ##STR00001##

A method of producing a refined copper includes depositing the refined copper on a cathode by an electroplating process or an electroless plating process in an alkaline plating bath including a solution of a copper compound that includes none of sulfur, chlorine and oxygen elements and produces copper ions having a valence of +1 in the solution.