A method for printed cable installation in a harness system of an aircraft. The method includes: printing at least a first conductive trace comprising conductive particles to a surface of an aircraft with a printing technology; printing at least second conductive trace comprising conductive particles to the surface of an aircraft with the printing technology; sintering the first and the second conductive traces by a laser, and interposing an insulating film between the first and the second conductive traces. For a trace length less than 5 meters, the first and second conductive traces provide the electromagnetic compatibility of a twisted pair of wires when printed with a guard trace.

A method for making a fiber electrically conductive comprises the steps of: (a) providing a fiber having a negative electric charge at the surface of the fiber, (b) applying to the fiber a substance (such as a polyelectrolyte) which provides a layer of said substance on the fiber and changes the electric charge at the surface of the fiber from negative to positive, wherein said substance is not chitosan, and (c) making the surface of the fiber electrically conductive with a metal, wherein the metal of step (c) is provided in the form of metal ions and wherein a reducing agent (for example) is employed to reduce the metal ions to elemental metal. Fabrics formed from conductive fibers are also provided.

A formed article includes a metal particle which has a particle size in a range from 1 m to 20 m and consists of an outer shell and a core part. The core part contains Sn or a Sn alloy. The outer shell contains an intermetallic compound of Sn and Cu and covers 50% or more of a total surface area of the core part.

A semiconductor module includes a semiconductor element, a substrate, and a bond connector designed as a gate resistor, shunt, resistor in an RC filter or fuse. The bond connector includes a core made of a first metal material and a jacket which is designed to envelope the core and made from a second metal material that is different from the first metal material, with the first metal material having an electrical conductivity which is lower than an electrical conductivity of the second metal material. At least one of the semiconductor element and the substrate is connected to the bond connector.

A composite conductive structure includes plural enameled wires and a copper foil. The enameled wires are immediately adjacent to each other and extend in the same direction. The copper foil surrounds the outside of the enameled wires at least once, and completely covers the entire outside of the enameled wires.

A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 m or more.

There is provided herein a fiber including a fiber body with a fiber body material having a longitudinal axis along a fiber body length. A plurality of devices is disposed as a linear sequence of devices within the fiber body. Each device includes at least one electrical contact pad. At least one electrical conductor is disposed within the fiber body. The electrical conductor is electrically connected to an electrical contact pad of devices in the plurality of devices. A weavable device includes at least one device material arranged in a planar device configuration and connected to an electrical contact pad. An electrically insulating, mechanically flexible fiber body material encapsulates the planar device configuration and contact pad and has a fiber body length greater than 10 m. An electrical conductor is electrically connected to a device contact pad and extends the fiber body length.

An Electro Static Discharge (ESD) Safe Liner device made from Carbon Filled EVA Sheet and Film that provides the ways a liner can provide a safe method to prevent Electro static discharges from containers transporting various materials. Additionally, the Cuff or the thin mil film material fastened to the top of the liner provides a capability where there is enough excess material at the top of the liner which, when removed is than gathered in a variety of methods and contains any residual from the unused material within the liner for proper disposal and no mess. The container liners are for large and small containers and prove themselves extremely efficient.

Ultra-conductive wires having enhanced electrical conductivity are disclosed. The conductivity of an ultra-conductive wire is enhanced using cold wire drawing and annealing. Methods of making the ultra-conductive wires are further disclosed.

A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 m to 1.2 m (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of Cu.sub.6Sn.sub.5, with some of the copper in the Cu.sub.6Sn.sub.5 being substituted by nickel, and has an average crystal grain diameter of from 0.2 m to 1.5 m (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 m to 1.0 m (inclusive) and an average crystal grain diameter of from 0.01 m to 0.5 m (inclusive).