This stabilizer material for superconductor includes a copper material, wherein the copper material contains one kind or two kinds or more of additive elements selected from Ca, La, and Ce for a total amount of 3 ppm by mass or more and 400 ppm by mass or less, with the remainder being Cu and unavoidable impurities, and the total concentration of the unavoidable impurities other than O, H, C, N, and S, which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, and compounds including one kind or two kinds or more selected from CaS, CaSO.sub.4, LaS, La.sub.2SO.sub.2, CeS, and Ce.sub.2SO.sub.2 are present in the matrix.

An endoscope cable includes a plurality of individual cables, and is provided with an entire shield portion including a metal wire group having an electric shield function to surround entirety of the plurality of individual cables, and a cable core wire including a metal wire group in each of the individual cables. The metal wire group in at least one of the entire shield portion and the cable core wires is configured by combining a plurality of types of metal wires having different compositions from each other.

A deep sea lifting cable having a cable core (36) surrounded by armouring (32), wherein the armouring is surrounded by an outer jacket (33), wherein the cable core comprises at least one power cable (10) is disclosed. The armouring (32) comprises synthetic stiff ropes and interstices (35) between the stiff ropes are filed with a high viscous filler.

The problem addressed by the present invention is to provide a copper-coated aluminum wire material with a reduced weight and excellent adhesiveness, and a production method therefor.

This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.

A cable is composed of a cable core including one or more electric wires, a shield layer covering around the cable core, and a sheath covering around the shield layer. The shield layer includes a braided shield braided in such a manner that first metal wires composed of aluminum or an aluminum alloy intersect with second metal wires composed of copper or a copper alloy. An outer diameter of each of the second metal wires is larger than an outer diameter of each of the first metal wires.

An improved electrical contact alloy, useful for example, in vacuum interrupters used in vacuum contactors is provided. The contact alloy according to the disclosed concept comprises copper particles and chromium particles present in a ratio of copper to chromium of 2:3 to 20:1. The electrical contact alloy also comprises particles of a carbide, which reduces the weld break strength of the electrical contact alloy without reducing its interruption performance.

It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390 C. or less. And, connection resistance between the joined members exhibits less than 110.sup.5 /mm.sup.2.

A copper alloy for and electric and an electronic device is provided. The copper alloy includes: Mg in a range of 0.15 mass % or more and less than 0.35 mass %; Pin a range of 0.0005 mass % or more and less than 0.01 mass %; and a Cu balance including inevitable impurities. In the copper alloy, a Mg content [Mg] and a P content [P], both of which are in a mass ratio, satisfy a relationship expressed by [Mg]+20[P]<0.5, and an electrical conductivity of the copper alloy is more than 75% IACS.

A rectangular rolled copper foil includes copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa. In a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5 from a Cube orientation is greater than or equal to 8%.

A shielded cable includes an inner conductor, an insulation covering an outer periphery of the inner conductor, and an outer conductor covering an outer periphery of the insulation. The outer conductor includes a first outer conductor covering the outer periphery of the insulation and including a served shield with first element wires spirally wound, and a second outer conductor covering an outer periphery of the first outer conductor and including a braided shield with second element wires braided.