According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

The present invention provides a CuCoNiSi alloy for an electronic component having improved reliability in which in addition to high strength and high electrical conduction, bendability generally difficult to achieve with strength is also provided to a Corson copper alloy. The present invention is a CuCoNiSi alloy for an electronic component comprising 0.5 to 3.0% by mass of Co and 0.1 to 1.0% by mass of Ni, a concentration (% by mass) ratio of Ni to Co (Ni/Co) being adjusted in the range of 0.1 to 1.0, the alloy comprising Si so that a (Co+Ni)/Si mass ratio is in the range of 3 to 5, and comprising a balance comprising Cu and unavoidable impurities, wherein a coefficient of variation of concentration ratios of Co to Ni (Co/Ni) measured for at least 100 second-phase particles is 20% or less.

A power cable may include a first plurality of copper alloy wires having a first percentage of strengthening alloying material and a second plurality of copper alloy wires having a second percentage of strengthening alloying material. One or more of the second plurality of copper alloy wires may abut one or more of the first plurality of copper alloy wires. The second percentage of strengthening alloying material may be different than the first percentage of strengthening alloying material. Computing devices using power cables are also described.

A core wire includes: an inner conductor; and an insulating layer covering the inner conductor, wherein the insulation layer is made by 3D printing process, the insulating layer includes a first semi-insulating layer and a second semi-insulating layer, each of the first semi-insulating layer and the second semi-insulating layer has a groove that matchingly accommodates the shape of the inner conductor, and the first semi-insulating layer and the second semi-insulating layer are combined together.

A copper-silver-gold alloy is provided for an electrical, electronic and/or electrotechnical component and/or for a device for sound reproduction and/or recording and/or for sound signal processing, output, reception and/or transmission, in particular for an audio reproduction system. In order to achieve a timbre which is both warm and also has a certain radiant power and elasticity, the alloy includes, relative to the total weight of the alloy, ?99.70 wt. % to ?99.98 wt. % copper, ?0.01 wt. % to ?0.20 wt. % silver and ?0.01 wt. % to ?0.10 wt. % gold.

A transparent conductive film containing an alkali tungsten bronze is provided. The alkali tungsten bronze exhibits a pattern of a hexagonal crystal as a powder X-ray diffraction pattern and is free of shift to an orthorhombic crystal, a trigonal crystal, and a pyrochlore phase.

The present invention controls the fluctuations of Ti concentration in a copper titanium alloy from a perspective different from conventional perspectives to improve the strength and bending workability of the copper titanium alloy. A copper titanium alloy for electronic components comprising 2.0 to 4.0 mass % of Ti, and 0 to 0.5 mass %, in total, of one or more elements selected from the group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and P as a third element, with the balance being copper and unavoidable impurities, wherein a coefficient of variation in a Ti concentration fluctuation curve is 0.2 to 0.8, the Ti concentration fluctuation curve being obtained when Ti in a matrix phase for <100>-oriented crystal grains in a cross section parallel to a rolling direction is subjected to line analysis by EDX, and in structure observation of a cross section parallel to the rolling direction, a number of second-phase particles having a size of 3 m or more per an observation field of view of 10000 m.sup.2 is 35 or less.

The present invention is a cable, which carries signal, having an integrated coiling and reinforcing wrapper. The cable has a segment near an end that is stiffer than the cable generally. This segment can be bent by hand, and once bent, will retain its bent shape. If the flexible part of the cable is wrapped into a coil, or otherwise gathered together, then the stiffer portion can be bent around the gathered portion to secure it in its gathered form.

Noble metal-coated nanostructures and related methods are disclosed. According to an aspect, a nanostructure may include a structure comprising a base metal. As an example, the structure may be a nanowire. In a more specific example, the structure may be a copper nanowire or a nanowire made of a base metal such as nickel, tin, indium, zinc, the like, or combinations thereof. The base metal structure may be coated with a noble metal that conformally covers the base metal structure. Example noble metals include, but are not limited to, ruthenium, rhodium, palladium, silver, iridium, platinum, and gold. The coating may be made of one or more of the noble metals along with other materials.

Aspects of the present disclosure relate to providing cable assemblies for cellular base stations having remote radio head units located atop a radio tower. Each installation requires near-custom cabling, as the electrical resistance of the conductors of the cable assembly varies based on the length of the cable assembly, and because different operators and local governments require different color-coding of the conductors which are coupled to the power trunk. Accordingly, a power distribution system is provided herein wherein conductors of a trunk cable may be coupled to power jumper conductors at transitions. The transitions are generally cylindrical and comprise channels into which splicing lugs are seated. The conductors may be electrically coupled together and secured via set screws. Manufacturing costs may be reduced, as common configurations of trunk cables may be manufactured in higher quantity and coupled to power jumper conductors according to local requirements.