The present invention relates generally to a method of manufacturing far-infrared radiation thermal wire and far-infrared radiation thermal wire thereby, more particularly, a method of manufacturing far-infrared radiation thermal wire and far-infrared radiation thermal wire manufactured thereby, in which electric power is supplied with a predetermined resistance value.

According to an embodiment of the present invention, a method of manufacturing far-infrared radiation thermal wire comprise steps of: making microfine wire that emits far-infrared radiation as it generates heat according to the resistance value when electricity is flowed in; making one strand of thermal wire by bundling many strands of the microfine wire that are in contact of each other; and making two or more groups each of the groups having different resistance value and comprising one or more microfine wires that have identical resistance value in order to make the bundle into an effective geometric structure that well radiates electric dipole radiation while emitting far-infrared radiation.

The invention is directed to a touchscreen keyboard attachment for a personal computer. The attachment is small, easily carried, and comprises a rectangular touchscreen displaying a keyboard image, such that it may be easily grasped, carried, and plugged into a Universal Service Bus (USB) port on the user's personal computer, laptop, or other electronic device. The attachment provides data input to device in the same protocol as an external keyboard.

A conducting wire end portion joining method is a method for conductively joining together end portions of conducting wires each covered with an insulation coating. The conducting wire end portion joining method includes: adjoining end portions of two winding wires, and bringing the end portions of the conducting wires of the two winding wires into contact with a conductive coating material stored in an insulating cap having a property of shrinking when heated; and shrinking the insulating cap by heating to fix the shrunken insulating cap around the insulation coatings of the end portions of the two winding wires, and joining together the end portions of the two winding wires by conductively connecting the conducting wires of the two winding wires via the hardened conductive coating material.

The conductive film is arranged on the support and contains a binder and a metal portion, in which a position at which the contour line reaches the metal portion included in the thin conductive wire is set as an upper end position, and an average area ratio VA of the metal portion in a region ranging from the upper end position to 100 nm toward the support side is 1% or more and less than 50%, and a position at which the contour line reaches the thin conductive wire does not include the metal portion is set to a lower end position, and an average area ratio VM1 of the metal portion in a region ranging from a middle position between the upper end position and the lower end position to 50 nm toward the support side and to 50 nm toward the surface X side is 50% or more.

The present invention relates to a surface modified overhead conductor with a coating that allows the conductor to operate at lower temperatures. The coating contains about 5% to about 30% of an inorganic adhesive, about 45% to about 92% of a filler, about 2% to about 20% of one or more emissivity agents, and about 1% to about 5% of a stabilizer.

Provided herein are nanofibers and processes of preparing nanofibers. In some instances, the nanofibers are metal and/or ceramic nanofibers. In some embodiments, the nanofibers are high quality, high performance nanofibers, highly coherent nanofibers, highly continuous nanofibers, or the like. In some embodiments, the nanofibers have increased coherence, increased length, few voids and/or defects, and/or other advantageous characteristics. In some instances, the nanofibers are produced by electrospinning a fluid stock having a high loading of nanofiber precursor in the fluid stock. In some instances, the fluid stock comprises well mixed and/or uniformly distributed precursor in the fluid stock. In some instances, the fluid stock is converted into a nanofiber comprising few voids, few defects, long or tunable length, and the like.

Systems and methods of fabricating electrodes, including thin metallic films, include depositing a first metallic layer on a substrate and passivating the deposited layer. The processes of deposition and passivation may be done sequentially. In some embodiments, a plurality of substrates may be coated with a metallic layer and further processed at a later time, including passivation and disposal of additional layers as discussed herein.

A high-strength and high-electrical conductivity copper alloy rolled sheet has an alloy composition containing 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn and the balance including Cu and inevitable impurities, wherein [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0([Co]0.007)/([P]0.009)5.9. In a metal structure, precipitates are formed, the shape of the precipitates is substantially circular or elliptical, the precipitates have an average grain diameter of 1.5 to 9.0 nm, or 90% or more of all the precipitates have a diameter of 15 nm or less to be fine precipitates, and the precipitates are uniformly dispersed. With the precipitation of the fine precipitates of Co and P and the solid-solution of Sn, the strength, conductivity and heat resistance are improved and a reduction in costs is realized.

An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D.sub.50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size D.sub.Cryst of 20 nm or less as determined by an X-ray analysis, and a ratio (D.sub.Cryst/D.sub.50BET) of the mean crystallite size D.sub.Cryst to the mean particle size D.sub.50BET of less than 0.4.

The invention relates to an elongated electrically conductive copper-aluminum bimetal element, a cable comprising at least one such elongated electrically conductive element, a process for preparing said elongated electrically conductive element and said cable, and a device comprising such an electric cable and at least one metal connector.