H01B1/026

Electroconductive Paste, Electronic Substrate, and Method for Manufacturing Said Substrate
20190132961 · 2019-05-02 · ·

A conductive paste includes a high melting point metal particle having a melting point exceeding a baking temperature, a molten metal particle containing a metal or an alloy which melts at a temperature equivalent to or lower than the baking temperature and has a melting point of 700 C. or lower, an active metal particle containing an active metal, and an organic vehicle.

System, composition and method of application of same for reducing the coefficient of friction and required pulling force during installation of wire or cable

A composition and method for reducing the coefficient of friction and required pulling force of a wire or cable are provided. A composition of aqueous emulsion is provided that is environmentally friendly, halogen free and solvent free. The composition is compatible with various types of insulating materials and may be applied after the wire or cable is cooled and also by spraying or submerging the wire or cable in a bath. The composition contains lubricating agents that provide lower coefficient of friction for wire or cable installation and continuous wire or cable surface lubrication thereafter.

Power cable for cable deployed electric submersible pumping system

A technique facilitates construction and operation of a power cable which may be used to deploy an electric submersible pumping system downhole into a wellbore. The power cable is constructed to provide structural support of the electric submersible pumping system while also providing electric power to the electric submersible pumping system when located downhole in the wellbore. The power cable has at least one conductor and a plurality of layers selected and arranged to ensure long-term support and delivery of electrical power in the relatively harsh downhole environment.

Rotor construction for high speed motors

A rotor shaft for a high speed motor that has a coating that is secured to a shaft body. The coating and the shaft body are formed from dissimilar materials. More specifically, the coating may be an alloy material, such as, for example, a copper alloy, while the shaft body may be a steel material. According to certain embodiments, the alloy material of the coating may be secured to at least a portion of a rotor body blank in a solution treated condition via a low temperature welding procedure. Additionally, the coating may be hardened, such as for example, through the use of an age hardening process. The coating and the rotor body blank may be machined together to form the rotor shaft. According to certain embodiments, such machining may configure the rotor shaft for use with a turbo-compressor that is configured for air compression.

Cu—Ni—Si-based copper alloy sheet having excellent mold abrasion resistance and shear workability and method for manufacturing same

A CuNiSi-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the NiSi precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm.sup.2, and the number of the NiSi precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm.sup.2, a/b is in a range of 0.5 to 1.5.

COPPER NANOFIBER, ITS PREPARATION METHOD AND DISPLAY PANEL

The present disclosure relates to a copper nanofiber, its preparation method and a display panel. The copper nanofiber comprises a copper nanofiber body, an aluminum-doped zinc oxide layer disposed at the external surface of the copper nanofiber body, and a passivation layer disposed on a side of the aluminum-doped zinc oxide layer away from the copper nanofiber body.

Coated conductors

An assembly can include a housing that includes opposing ends, a longitudinal axis, an axial length defined between the opposing ends, a maximum transverse dimension that is less than the length and an interior space; circuitry disposed at least in part in the interior space; and a coated electrical conductor electrically coupled to the circuitry where the coated electrical conductor includes an electrical conductor that includes copper and a length defined by opposing ends, a polymeric electrical insulation layer disposed about at least a portion of the length of the electrical conductor, and a barrier layer disposed about at least a portion of the polymeric electrical insulation layer.

Highly bendable insulated electric wire and wire harness
10242766 · 2019-03-26 · ·

A highly bendable insulated electric wire includes a conductor part that has a plurality of non-compressed strands made of a copper alloy, each of the non-compressed strands having a cross-sectional area of 0.13 sq. mm, and a covering part that is provided on the conductor part, wherein the conductor part has an elongation of 7% or more and a tensile strength of 500 MPa or more, and the covering part is made of 100 degree Celsius heat-resistant polyvinyl chloride and has an elongation of 100% or more at a temperature of 40 degree Celsius.

Copper alloy wire rod and method for manufacturing copper alloy wire rod

A copper alloy wire rod containing Ag: 0.5 wt % or more and 6 wt % or less and the balance including inevitable impurities and Cu, in which, on a cross section parallel to a longitudinal direction of the copper alloy wire rod, within a range observed with a visual field of 1.7 m in a direction perpendicular to the longitudinal direction and 2.3 m in a direction parallel to the longitudinal direction, the copper alloy wire rod has at least one rectangular range that is a rectangular range having a width perpendicular to the longitudinal direction of 0.2 m and a length parallel to the longitudinal direction of 2.3 m and entirely includes five or more second phase particles containing Ag and having a maximum length in the longitudinal direction of less than 300 nm.

NANOSTRUCTURE BARRIER FOR COPPER WIRE BONDING

A nanostructure barrier for copper wire bonding includes metal grains and inter-grain metal between the metal grains. The nanostructure barrier includes a first metal selected from nickel or cobalt, and a second metal selected from tungsten or molybdenum. A concentration of the second metal is higher in the inter-grain metal than in the metal grains. The nanostructure barrier may be on a copper core wire to provide a coated bond wire. The nanostructure barrier may be on a bond pad to form a coated bond pad. A method of plating the nanostructure barrier using reverse pulse plating is disclosed. A wire bonding method using the coated bond wire is disclosed.