Forming a conductive film comprising depositing a non-conductive film on a surface of a substrate, wherein the film contains a plurality of copper nanoparticles and exposing at least a portion of the film to light to make the exposed portion conductive. Exposing of the film to light photosinters or fuses the copper nanoparticles.

A covered electric wire comprises an insulating coating layer on the outer side of a conductor. The conductor comprises a copper alloy consisting of: not less than 0.05% by mass and not more than 2.0% by mass of Fe; not less than 0.02% by mass and not more than 1.0% by mass of Ti; not less than 0% by mass and not more than 0.6% by mass of Mg; and the balance being Cu and impurities. The covered electric wire is a stranded wire comprising a plurality of copper alloy wires stranded together. The plurality of copper alloy wires each have a work hardening coefficient of not less than 0.1 and a wire diameter of not more than 0.5 mm.

A wire-drawing method comprises providing a rod comprising a wrapped sheet, wherein the sheet comprises a plurality of copper layers and a plurality of graphene layers; extracting an inner layer of the wrapped sheet from the rod to form a spiral; and forming a wire by feeding the spiral through an opening of a die unit.

A method for forming a multilayer composite structure comprises providing a first sheet comprising a copper-comprising layer sandwiched by first and second graphene layers, wrapping the first sheet to form a first rod, and compacting the first rod to form a first multilayer composite structure.

This superconducting wire includes: a strand including a superconducting material; and a stabilizer material for superconductor arranged in contact with the strand, wherein the stabilizer material for superconductor includes a copper material which contains one kind or two kinds or more of additive elements selected from Ca, Sr, Ba, and rare earth elements (RE) for a total amount of 3 ppm by mass or more and 400 ppm by mass or less, with the remainder being Cu and unavoidable impurities, the total concentration of the unavoidable impurities other than O, H, C, N, and S, which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, and compounds including one kind or two kinds or more selected from CaS, CaSO.sub.4, SrS, SrSO.sub.4, BaS, BaSO.sub.4, (RE)S, and (RE).sub.2SO.sub.2 are present in the matrix.

A method of manufacturing a dynamic power cable (1) includes providing a cable core (2) made of an electrical conductor (3) and an electrically insulating layer (4) arranged radially outside of the electrical conductor (3). A metallic sheet (7) is wrapped radially around the cable core (2) the metallic sheet (7) having a copper-nickel alloy. Opposing edges of the metallic sheet (7) are welded together to form a continuous water barrier layer (5) around the cable core (2). The welding (8) is performed by autogenous welding.

An electric connection is provided, and has a first copper (Cu) layer, a second Cu layer, and a composite metal layer disposed between the first Cu layer and the second Cu layer. The composite metal layer has 0.01 wt. %gallium (Ga)20 wt. %, 0.01 wt. %copper (Cu)50 wt. %, and 30 wt. %nickel (Ni)99.98 wt. %. Moreover, a method of manufacturing the electric connection is provided, and has the steps of: (1) providing a first Cu layer and a second Cu layer; (2) forming a first Ni layer on the first Cu layer; (3) forming a second Ni layer on the second Cu layer; (4) forming a Ga layer on the first Ni layer; and (5) keeping the second Ni layer in contact with the Ga layer and carrying out a thermo-compress bonding therebetween to form the electric connection.

A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.

An electrical connection system configured to terminate electrical connectors and to transmit digital electrical signals having a data transfer rate of 5 Gigabits per second (Gb/s) or higher. The system includes a first parallel mirrored pair of terminals having a planar connection portion and a second pair of parallel mirrored terminals having a cantilever beam portion and a contact points configured to contact the first terminals. The cantilever beam portions are generally perpendicular to the planar connection portions. The terminals cooperate to provide consistent characteristic impedance. The connection system further includes an electromagnetic shield that longitudinally surrounds the terminals. The connection system is suited for terminating wire cables transmitting digital signals using data transfer protocols such as Universal Serial Bus (USB) 3.0 and High Definition Multimedia Interface (HDMI) 1.4.

An insulated wire, containing: a rectangular conductor; and a thermoplastic resin layer on the rectangular conductor, wherein an adhesion strength between the thermoplastic resin layer and the rectangular conductor for a pair of sides of the rectangular conductor opposed to and an adhesion strength between the thermoplastic resin layer and the rectangular conductor for the other pair of sides of the rectangular conductor opposed to are different from each other.