A wire material for a connector terminal contains 0.1% to 1.5% by mass of Fe, 0.05% to 0.7% by mass of Ti, and 0% to 0.5% by mass of Mg, with the balance being Cu and impurities.

Provided is a copper alloy for electronic and electrical equipment including: 0.15 mass % or greater and less than 0.35 mass % of Mg; 0.0005 mass % or greater and less than 0.01 mass % of P; and a remainder which is formed of Cu and unavoidable impurities, in which a conductivity is greater than 75% IACS, and an average number of compounds containing Mg and P with a particle diameter of 0.1 m or greater is 0.5 pieces/m.sup.2 or less in observation using a scanning electron microscope.

According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a composition including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.

A copper alloy sheet material comprises (by mass %) from 2.50 to 4.00% in total of Ni and Co, from 0.50 to 2.00% of Co, from 0.70 to 1.50% of Si, from 0 to 0.50% of Fe, from 0 to 0.10% of Mg, from 0 to 0.50% of Sn, from 0 to 0.15% of Zn, from 0 to 0.07% of B, from 0 to 0.10% of P, from 0 to 0.10% of REM, from 0 to 0.01% in total of Cr, Zr, Hf, Nb and S, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles (particle diameter of 5 mm or more) is 10 per mm.sup.2 or less. A number density of fine secondary phase particles (particle diameter of from 5 to 10 nm) is 1.0.Math.10.sup.9 per mm.sup.2 or more. A Si concentration in the parent phase is 0.10% by mass or more.

An insulated wire that has a stranded wire conductor, and an insulator that covers an outer circumference of the stranded wire conductor. The stranded wire conductor is made up of at least a plurality of copper-based element wires twisted together, and has been heat-treated after circular compression. The copper-based element wire(s) has (have) an Ni-based plated layer on the surface. The Ni-based plated later has been compressed by the circular compression. The insulator is composed of a cross-linked ethylene-tetrafluoroethylene based copolymer, and has a heating deformation rate in the range of 65% or more, as determined under predetermined conditions using predetermined formulae in conformity with ISO6722.

The present invention addresses the problem of providing an electroconductive composition which, even when burned in the air, can form an electroconductive film that exhibits satisfactory electroconductivity and moist-heat resistance. The problem is solved with an electroconductive composition which comprises: a surface-treated copper powder (AB) comprising a copper powder (A) and an ascorbic acid derivative (B) adherent to the surface thereof; a binder resin (C); and a dispersant (D) having an acidic group.

One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90, and a strength ratio TS.sub.TD/TS.sub.LD of tensile strength TS.sub.TD in a direction perpendicular to a rolling direction to tensile strength TS.sub.LD in a direction parallel to the rolling direction exceeds 1.09.

The invention relates to an electrical conductor which is made up substantially of one or even several metal conductors which are sheathed by a graphene layer. Particularly in the case of the electrical conductor transporting an alternating current, the current in the conductor is forced radially outwards and therefore flows in the graphene layer. Since graphene has a substantially better conductivity than the materials customary in this application, such as copper for example, relatively low losses are accordingly produced and substantially higher degrees of efficiency can be achieved. The electrical conductor constructed in this way is used in a stator and/or rotor winding of an electrical machine, so that it has a significantly elevated power-to-weight ratio.

A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conductive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors. The composition for forming a conductive pattern, comprises: a polymer resin; and a non-conductive metal compound having a predetermined chemical structure, and may be a composition for forming a conductive pattern through electromagnetic irradiation, by which a metal nucleus is formed from the non-conductive metal compound.