An attachment device includes a central body formed of a plastic material and defining a cavity configured to receive a temperature probe and a plurality of straps extending from the central body. Each strap of the plurality of straps is configured to secure a cable to the central body. The central body defines a wall having a first side configured to be in contact with the temperature probe and a second side in contact with a cable. This attachment device may notably be used in an electrical connection assembly having a connector, a temperature sensor disposed within the device, and at least two cables.

An elastic conductor includes a stretchable base, and conductors each having a longitudinal shape, being arranged on a surface of the stretchable base, and having a lower specific resistance and a higher modulus of elasticity than the stretchable base. In the first state, the conductors are spaced apart from each other in the second direction perpendicular or substantially perpendicular to the first direction, and are continuous in a section extending in the first direction as seen in the second direction from one end of the section to the other end of the section, in which a distance between the conductors adjacent to each other in the second direction in the second state is shorter than a distance between the conductors adjacent to each other in the second direction in the first state.

An electrical connection system configured to terminate electrical connectors and to transmit digital electrical signals having a data transfer rate of 5 Gigabits per second (Gb/s) or higher. The system includes a first parallel mirrored pair of terminals having a planar connection portion and a second pair of parallel mirrored terminals having a cantilever beam portion and a contact point configured to contact the first terminals.

Apparatuses and associated methods of manufacturing are described that provide an adaptive connector configured to connect between a cable connector and a switch module in a datacenter. The adaptive connector includes a body defining a top, bottom, and two side portions extending between the top and bottom portion. The body of the adaptive connector defines a first end for receiving the cable connector and a second end that is received by a switch module for enabling signals to pass between the cable connector and switch module. The adaptive connector further defines a heat dissipation elements for transferring heat between the adaptive connector and an external environment of the adaptive connector.

A multi-strand composite electrical conductor assembly includes a strand formed of carbon nanotubes and an elongated metallic strand having substantially the same length as the carbon nanotube strand. The assembly may further include a plurality of metallic strands that have substantially the same length as the carbon nanotube strand. The carbon nanotube strand may be located as a central strand and the plurality of metallic strands surround the carbon nanotube strand. The metallic strand may be formed of a material such as copper, silver, gold, or aluminum and may be plated with a material such as nickel, tin, copper, silver, and/or gold. Alternatively or additionally, the metallic strand may be clad with a material such as nickel, tin, copper, silver, and/or gold.

There is provided a copper-titanium alloy with large fluctuations in Ti concentration. The copper-titanium alloy for electronic components contains 2.0 to 4.0% by mass of Ti and, as a third element, 0 to 0.5% by mass in total of one or more selected from a group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and P, with a balance being copper and unavoidable impurities, wherein when crystal grains having <100> orientation in a section parallel to a rolling direction are subjected to area analysis of Ti concentration in a matrix phase, a difference between a maximum Ti concentration and a minimum Ti concentration is 5 to 16% by mass.

A formed article includes a metal particle which has a particle size in a range from 1 m to 20 m and consists of an outer shell and a core part. The core part contains Sn or a Sn alloy. The outer shell contains an intermetallic compound of Sn and Cu and covers 50% or more of a total surface area of the core part.

A superconductive wire conductor is produced by: embedding a plurality of deposition substrates formed to have a predetermined size in parallel with each other to a connection base material to connect and integrate therewith; depositing an intermediate layer, a superconductive layer and a protective layer on a deposition surface side of the deposition substrate; and winding a single or multiple integrated superconductive conductors around a desired core material, separating each single superconductive wire from the integrated superconductive conductor and winding each superconductive wire around the core material or winding the integrated or separated wire alternately, whereby a superconductive conductor having a good superconductive characteristic without a problem regarding a shape thereof such as local protrusions.

A CuBe alloy according to the present invention is a Co-containing CuBe alloy, in which the Co content is 0.005% to 0.12% by mass, and the number of CuCo-based compound particles having a particle size of 0.1 m or more that can be confirmed on a TEM image at a magnification of 20,000 is five or less in a field of view of 10 m10 m. Furthermore, a method for producing a CuBe alloy according to the present invention includes a solution annealing treatment step of subjecting a CuBe alloy raw material containing 0.005% to 0.12% by mass of Co and 1.60% to 1.95% by mass of Be to solution annealing treatment to obtain a solution-annealed material.

The present disclosure provides a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal, and the total thickness of the multi-layered anisotropic conductive adhesive is 40 to 60 m. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive of the present disclosure has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. The disclosure further provides a method of producing the multi-layered anisotropic conductive adhesive.