Patent classifications
H01B1/026
Copper alloy element wire, copper alloy stranded wire, and automotive electric wire
A copper alloy element wire 1 has a chemical composition including: 0.45 mass % or more and 2.0 mass % or less, in total, of at least one additive element selected from the group consisting of Fe, Ti, Sn, Ag, Mg, Zn, Cr and P; in mass ppm, 10 ppm or less of H content, and the balance being Cu and unavoidable impurities. A copper alloy stranded wire 2 includes a plurality of the copper alloy element wires 1 twisted together. An automotive electric wire 5 includes the copper alloy stranded wire 2 and an insulator 3 that covers the outer periphery of the copper alloy stranded wire 2.
ELECTRICALLY CONDUCTIVE NANOSTRUCTURES
A structure includes a high-strength nanowire core with a first electrically-conductive metal layer bonded to an outer surface thereof. An insulating layer is bonded to an outer surface of the first electrically-conductive metal layer, and a second electrically-conductive metal layer is bonded to an outer surface of the insulating layer. The nanowires are braided into a litz bundle, which reduces electrical losses during transmission of high-frequency current.
Composition for forming conductive pattern and resin structure having conductive pattern
The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.
TOUCH PANEL
The disclosure relates to a touch panel. The touch panel includes a substrate having a surface, a metal nanowire film, at least one electrode, and a conductive trace. The metal nanowire film includes a metal nanowire film. The metal nanowire film includes a number of first metal nanowire bundles parallel with and spaced from each other. Each of the number of first metal nanowire bundles includes a number of first metal nanowires parallel with each other. The first distance between adjacent two of the number of first metal nanowires is less than the second distance between adjacent two of the number of first metal nanowire bundles.
PHOSPHORUS-CONTAINING COPPER POWDER AND METHOD FOR PRODUCING THE SAME
An object of the present invention is to provide a phosphorus-containing copper powder with good volume resistivity and a small carbon content by suppressing an oxygen content to a relatively low value even if a particle size is made small, and a method for producing the same. In the phosphorus-containing copper powder containing phosphorus, a ratio of an oxygen content (wt. %) to a BET specific surface area (m.sup.2/g) (oxygen content/BET specific surface area) is 0.90 wt. %.Math.g/m.sup.2 or less, a divalent copper compound is present on a surface of particles constituting the phosphorus-containing copper powder, a carbon content is 0.10 wt. % or less, and D50 is 7.11 m or less.
COPPER ALLOY FOR ELECTRONIC AND ELECTRIC DEVICE, COMPONENT FOR ELECTRONIC AND ELECTRIC DEVICE, TERMINAL, AND BUS BAR
Provided is a copper alloy for an electronic and electric device, including: Mg in a range of 0.5 mass % or more and 3.0 mass % or less; and a Cu balance including inevitable impurities, in which, a graph, in which a vertical axis is d.sub.t/d.sub.t and a horizontal axis is a true strain .sub.t, d.sub.t/d.sub.t being defined by a true stress .sub.t and the true strain .sub.t, obtained in a tensile test of the copper alloy, has a strained region that has a positive slope of d.sub.t/d.sub.t.
TRANSPARENT CONDUCTORS
The disclosure provides for transparent conductors comprised of metal-reduced graphene oxide or graphene core-shell nanowires, process of preparation thereof, and methods of use thereof.
ELECTRICALLY CONDUCTIVE CARBON NANOTUBE WIRE HAVING A METALLIC COATING AND METHODS OF FORMING SAME
An attachment device includes a central body formed of a plastic material and defining a cavity configured to receive a temperature probe and a plurality of straps extending from the central body. Each strap of the a plurality of straps configured to secure a cable to the central body. The central body defines a wall having a first side configured to be in contact with the temperature probe and a second side in contact with a cable. This attachment device may notably be used in an electrical connection assembly having a connector, a temperature sensor disposed within the device, and at least two cables.
System, composition and method of application of same for reducing the coefficient of friction and required pulling force during installation of wire or cable
A composition and method for reducing the coefficient of friction and required pulling force of a wire or cable are provided. A composition of aqueous emulsion is provided that is environmentally friendly, halogen free and solvent free. The composition is compatible with various types of insulating materials and may be applied after the wire or cable is cooled and also by spraying or submerging the wire or cable in a bath. The composition contains lubricating agents that provide lower coefficient of friction for wire or cable installation and continuous wire or cable surface lubrication thereafter.
Silver-coated copper alloy powder and method for producing same
A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D.sub.50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 m), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.