In a conductive film forming method using photo sintering, a conductive film having low electric resistance is easily formed. Disclosed is a conductive film forming method in which a conductive film is formed using a photo sintering, which includes the steps of: forming a liquid film made of a copper particulate dispersion on a substrate, drying the liquid film to form a copper particulate layer, subjecting the copper particulate layer to photo sintering to form a conductive film, attaching a sintering promoter to the conductive film, and further subjecting the conductive film having the sintering promoter attached to photo sintering. The sintering promoter is a compound which removes copper oxide from metallic copper. Thereby, the sintering promoter removes a surface oxide film of copper particulates in the conductive film.

A method of tailoring an amount of graphene in an electrically conductive structure, includes arranging a substrate material in a plurality of strands and arranging at least one graphene layer coated circumferentially on one or more of the strands of the plurality of strands, the graphene layer being a single atom-thick layer of carbon atoms arranged in a hexagonal pattern, the substrate material and the at least one graphene layer having an axial direction. A first cross-section taken along the axial direction of the substrate and the at least one graphene layer includes a plurality of layers of the substrate material and at least one internal layer of the graphene alternatively disposed between the plurality of layers of the substrate material.

Provided are a composite electric wire structure wherein a carbon material island structure is formed on a surface of a metal wire and a method for manufacturing the same. The carbon material/metal composite electric wire is capable of solving stability problem and preventing a decrease in electrical properties, mechanical properties, etc. In addition, the composite electric wire structure may be produced in commercially viable large scale.

An electrical connection system configured to terminate electrical connectors and to transmit digital electrical signals having a data transfer rate of 5 Gigabits per second (Gb/s) or higher. The system includes a first parallel mirrored pair of terminals having a planar connection portion and a second pair of parallel mirrored terminals having a cantilever beam portion and a contact point configured to contact the first terminals.

Provided is a copper powder that has an increased number of points of contact between copper powder particles, that ensures excellent conductivity, and that can be suitably used in a conductive paste, an electromagnetic wave shield, or the like. The copper powder is configured from flat plate-shaped copper particles that form a dendritic shape having a linearly grown main trunk and a plurality of branches branching from the main trunk. The main trunk and the branches have an average cross-sectional thickness of more than 1.0 m but no more than 5.0 m. The copper powder has a flat plate shape that is configured from a layered structure of one layer or a plurality of stacked layers. The average particle size (D50) is 1.0-100 m.

Multi-layer electrical contact elements include a flash palladium layer and an intermediate layer of binary hard silver/tin alloy having good corrosion resistance where inter-diffusion of metals between adjacent layers is inhibited to provide distinct interfaces between adjacent layers.

There is provided herein a fiber including a fiber body with a fiber body material having a longitudinal axis along a fiber body length. A plurality of devices is disposed as a linear sequence of devices within the fiber body. Each device includes at least one electrical contact pad. At least one electrical conductor is disposed within the fiber body. The electrical conductor is electrically connected to an electrical contact pad of devices in the plurality of devices. A weavable device includes at least one device material arranged in a planar device configuration and connected to an electrical contact pad. An electrically insulating, mechanically flexible fiber body material encapsulates the planar device configuration and contact pad and has a fiber body length greater than 10 m. An electrical conductor is electrically connected to a device contact pad and extends the fiber body length.

A copper alloy for and electric and an electronic device is provided. The copper alloy includes: Mg in a range of 0.15 mass % or more and less than 0.35 mass %; Pin a range of 0.0005 mass % or more and less than 0.01 mass %; and a Cu balance including inevitable impurities. In the copper alloy, a Mg content [Mg] and a P content [P], both of which are in a mass ratio, satisfy a relationship expressed by [Mg]+20[P]<0.5, and an electrical conductivity of the copper alloy is more than 75% IACS.

According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.

A method for manufacturing an insulated conductive material, the method including providing a wire, applying a masking material to one or more regions of the wire, coating regions of the wire other than the one or more regions with an insulating material by, electrically charging the wire with a first charge polarity, providing a medium of electrically charged insulating material particles that are charged with an opposite polarity, passing the charged wire through the medium, whereby the insulating material particles bind areas of the conductive material other than the one or more regions, curing the insulating material particles, and applying a solvent to the masking material to thereby remove the masking material, wherein the cured insulated material particles are substantially unaffected by the solvent.