A power tool, wherein the power tool has at least one current conductor, wherein a circumference U of the at least one current conductor is greater than two and a half times the square root of the product of a cross-sectional area A of the at least one current conductor and pi . The at least one current conductor can include a series of individual current conductors, wherein the circumference U of the at least one current conductor corresponds to the enveloping circumference of the individual current conductors, and wherein the cross-sectional area A of the at least one current conductor can be formed from the sum of the cross-sectional areas of the individual current conductors. The power tool can be connected to an energy supply device in order to be supplied with electrical energy. An energy supply device for use in a power tool, i.e. for supplying a power tool with electrical energy.

A lead wire including a lead conductor and a film covering at least a part of a surface of the lead conductor, wherein the film includes a trivalent chromium compound and a first metal, and a ratio of a concentration of the first metal to a concentration of the trivalent chromium compound on a surface of the film is 0.01 or more and 4.0 or less.

A cable includes: a cable core including one or more electrical wires; a shield layer made of a metallic wire arranged on a periphery of the cable core; and a sheath arranged on a periphery of the shield layer. The metallic wire is made of a copper alloy wire made of a copper alloy containing indium, a content of which is equal to or more than 0.3 mass % and equal to or less than 0.65 mass %, and the metallic wire has tensile strength that is equal to or higher than 350 MPa and elongation that is equal to or higher than 7%.

Disclosed herein is a copper alloy wire being a wire rod formed of a copper alloy and having a tensile strength of 400 MPa or more, an elongation at break of 5% or more, a conductivity of 60% IACS or more, and a wire diameter of 0.5 mm or less, wherein the copper alloy has a composition containing 0.05% by mass or more and 1.6% by mass or less of iron, 0.01% by mass or more and 0.7% by mass or less of phosphorus, and 0.05% by mass or more and 0.7% by mass or less of tin with the balance being copper and unavoidable impurities, the copper alloy has a structure containing crystals, and a crystal grain size difference determined as a difference between a maximum crystal grain size and a minimum crystal grain size in a cross-section is 1.0 m or less.

A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.

An article is provided to have a transparent substrate; and an electrically-conductive, metal-containing pattern disposed on a surface the transparent substrate. The electrically-conductive, metal-containing pattern has, in order outwardly from a surface of the transparent substrate: a first darkening agent; a metallic pattern; and a second darkening agent. The first darkening agent substantially conforms to a first surface of the metallic pattern, forming a first darkened surface on the metallic pattern. In addition, the second darkening agent is disposed over at least a portion of a second surface of the metallic pattern, forming a second darkened surface on the metallic pattern.

A rolled CuNiSi based copper alloy having excellent strength, electric conductivity, and bending coefficient is provided. The rolled copper alloy comprises 1.2 to 4.5% by mass Ni, 0.25 to 1.0% by mass Si, and the balance Cu with inevitable impurities. In the direction transverse to the rolling direction, the rolled copper alloy has a bending coefficient of 130 GPa or more and an electrical conductivity of 30% ICAS or more.

An electric wire capable of reducing an AC resistance equal to or less than the copper wire. In the electric wire in a single layered structure having a first layer of a substance having lower conductivity than copper, a radius of the wire is less than a skin depth, and an alternating current resistance value of the wire at a frequency used in the wire is greater than or equal to a sum of a direct current resistance value of the wire and a direct current resistance value of a copper wire having a same shape and a same outer diameter as the wire, and less than or equal to an alternating current resistance of the copper wire.

A method of the present invention includes preparing a substrate having a surface on which a electrode pad is formed, forming a resist layer on the substrate, the resist layer having an opening on the electrode pad, filling conductive paste in the opening of the resist layer; sintering the conductive paste in the opening to form a conductive layer which covers a side wall of the resist layer and a surface of the electrode pad in the opening, a space on the conductive layer leading to the upper end of the opening being formed, filling solder in the space on the conductive layer and removing the resist layer.

A lead-free solder alloy having a low melting temperature and low yield strength is disclosed. The solder alloy includes 5.0-20.0 wt. % of indium (In), 1.0-5.0 wt. % of silver (Ag), 0.25-2.0 wt. % of copper (Cu), 0.1-0.5 wt. % of zinc (Zn), and a remainder of tin (Sn). In implementations, a sulfur compound may be included in a concentration of 100 ppm to 500 ppm in the alloy to prevent oxidation of zinc and indium on the surface of the alloy. The solder alloy is particularly useful for but not limited to solder on pad applications in first level interconnect semiconductor device packaging.