Patent classifications
H01B1/026
Foam insulated conductors
An electrical cable comprising a conductor and a foamed insulation surrounding the conductor is disclosed. The foamed insulation has a uniform void size and an improved adhesion to the conductor. Electrical cables having a conductor thickness less than 22 mil are also disclosed.
Carbon-nanotubes copper composite conductors
Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.
System, composition and method of application of same for reducing the coefficient of friction and required pulling force during installation of wire or cable
A composition and method for reducing the coefficient of friction and required pulling force of a wire or cable are provided. A composition of aqueous emulsion is provided that is environmentally friendly, halogen free and solvent free. The composition is compatible with various types of insulating materials and may be applied after the wire or cable is cooled and also by spraying or submerging the wire or cable in a bath. The composition contains lubricating agents that provide lower coefficient of friction for wire or cable installation and continuous wire or cable surface lubrication thereafter.
Multi-dielectric coaxial push-cables and associated apparatus
Coaxial video push-cables are disclosed. One embodiment includes a central conductor and a multi-dielectric stack of multiple concentric tubular layers disposed around the central conductor having one or more structural layers and one or more impedance tuning layers where the thickness of materials of each layer are selected to provide a pre-defined elastic modulus and electromagnetic impedance, an electromagnetic shielding layer, and a jacket enclosing the shielding layer, multi-dielectric stack layers, and central conductor.
Copper alloy wire, plated wire, electric wire and cable using these
A copper alloy wire is composed of a copper alloy including indium of 0.3 mass % or more and 0.65 mass % or less, and has 0.2% proof stress of 300 MPa or more, electrical conductivity of 80% IACS or more, and elongation of 7% or more.
CABLE
A cable includes: two inner conductors arranged in parallel; and a sheath layer covering outside the two inner conductors, plural air holes being provided on the sheath layer; wherein the plural air holes are arranged at intervals and surround the two inner conductors as a whole, and there are no air holes between the two inner conductors.
Conductive element
Methods for producing a conductive element precursor and a conductive element, such as a tape or wire, are provided. The methods comprise growing a plurality of carbon nanotubes on a metallic substrate and coating carbon nanotubes of the plurality of carbon nanotubes on the metallic substrate with a metallic material.
Composite wire
A composite wire material may include a core wire including copper (Cu). The core wire material may include a first layer on a circumferential surface of the core wire, where the first layer includes graphene. The composite wire material may include a second layer on a circumferential surface of the first layer, where the second layer includes nickel (Ni).
GROUND CONDUCTOR
Ground conductors are disclosed. The ground conductors can include a core made primarily of a first material, such as steel. The ground conductor can include a surrounding sheath, which includes at least one layer made primarily of a second material, such as copper. The ground conductor has a ratio between its width and its thickness of no less than 11.1:1.
Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate
This copper alloy contains 10-100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise; 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50. The electrical conductivity is 97% IACS or greater. The half-softening temperature is 200 C. or higher. The residual stress ratio RS.sub.G at 180 C. for 30 hours is 20% or greater. The ratio RS.sub.G/RS.sub.B at 180 C. for 30 hours is greater than 1.0.