Grounding systems, grounding components, and methods of manufacturing, assembling, and using the same to provide dynamic and adaptable electrical grounding. In one aspect, an adaptable grounding system is provided. The grounding system may include a plurality of grounding components positioned to adaptively engage with an electrical-grounding surface, e.g., facilitating improved electrical contact. The grounding components may be mounted on a first structure which is opposite to a second structure that includes an electrical-grounding surface. The first structure and/or the second structure may be adjustable, e.g., between at least a first configuration, e.g., a non-grounded configuration, and a second configuration, e.g., a grounded configuration. The grounding systems, components, and related methods described herein may be used with different manufacturing systems and processes including those that are electrically-driven.

A conductive material includes a base material composed of copper or a copper alloy; an underlayer being one or more layers composed of one or more selected from the group consisting of Ni, Co and Fe; a CuSn alloy layer; and a Sn layer in this order. A part of the CuSn alloy layer is exposed on a Sn layer-side surface of the conductive material, and an arithmetic mean height evaluated with a cut-off value of 25 m is 0.03 m or more in a 250 m square region containing 50 area % or more of the Sn layer in the Sn layer-side surface of the conductive material.

A compressed stranded wire conductor includes an outer diameter of 0.1 mm or less, a central portion, a plurality of surrounding portions spirally twisted around the central portion, a first metal part in which the central portion and the plurality of surrounding portions are fitted together to form a circular cross-section as a whole, and a second metal part made of a metal having higher conductivity than the first metal part and covering each of the central portion and the plurality of surrounding portions, wherein the central portion, the plurality of the surrounding portions, and adjacent ones of the surrounding portions, are attached together with the second metal part in between.

This copper alloy having a high electrical conductivity and excellent heat resistance includes Mg in an amount of 10-100 mass ppm with a balance being Cu and inevitable impurities, which include S, P, Se, Te, Sb, Bi, and As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less. The electrical conductivity is 97% IACS or greater. The average value of orientation densities at 2=0, in a range of 1=0 to 20, and in a range of =35 to 55 is 1.3-20.0. The area ratio of crystals having a crystal orientation of 10 or less with respect to an S orientation {123}<634> is 10% or less.

A copper strip for edgewise bending can be edgewise-bent under a condition that a ratio R/W of a bending radius R to a width W is 5.0 or less. In the copper strip, a thickness t is in a range of 1 mm or more and 10 mm or less, and area ratio B/(A+B) is in a range of more than 10% and 100% or less in a square region where the length of one side is 1/10 of the thickness t, where an intersection of a straight line which contacts a surface and is parallel to a width direction and a straight line which contacts an end face and is perpendicular to the width direction is used as a reference in a cross section orthogonal to a longitudinal direction, A is an area where copper is present, and B is an area where copper is not present.

Embodiments of the disclosure describe a method that includes disposing an electrical insulator material over a layer of a ceramic-based material having vias and solid portions between the vias. The vias are filled with an electrically conductive metal that forms electrical paths through the layer of the ceramic-based material. A composite structure is formed that includes portions of the electrical insulator material that are fixed to the solid portions of the layer of the ceramic-based material. The composite structure further includes regions positioned between the portions of the electrical insulator material. The electrical insulator material has a first coefficient of thermal expansion (CTE), the electrically conductive metal has a second CTE, and the ceramic-based material has a third CTE that is greater than the first CTE and less than the second CTE.

An electrode wire for electrical discharge machining is provided. An electrode wire for electrical discharge machining of the present disclosure has a mass ratio of copper of 55.5 mass % or more and 58.5 mass % or less, a mass ratio of zinc of 41.5 mass % or more and 44.5 mass % or less, a diameter of 0.395 mm or more and 0.45 mm or less, and a tensile strength of 900 MPa or higher.

Superconductive diamagnetic compounds with CuS channel and a modified apatite structure, or other structures, at and above 0 C. and ambient pressure are described, along with methods for their synthesis and use. The compounds are characterized by an X-ray diffraction peak from CuS planes. The diamagnetic compounds can have a molecular formula Pb.sub.10-xCu.sub.x[P (O.sub.1-yS.sub.y).sub.4].sub.6O.sub.1-zS.sub.z(PCPOSOS), where 2.5x10,0<y1, and 0<z1.

A composition and method for reducing the coefficient of friction and required pulling force of a wire or cable are provided. A composition of aqueous emulsion is provided that is environmentally friendly, halogen free and solvent free. The composition is compatible with various types of insulating materials and may be applied after the wire or cable is cooled and also by spraying or submerging the wire or cable in a bath. The composition contains lubricating agents that provide lower coefficient of friction for wire or cable installation and continuous wire or cable surface lubrication thereafter.