A conductive silver aluminum paste includes the following components by weight percentage: 80.0%-90.0% of silver powder; 0.3%-2.5% of aluminum powder; 0.0%-1.5% of silicon powder; 1.0%-6.0% of first-type glass powder; 0.5%-4.0% of second-type glass powder; and 7.0%-15.0% of organic vehicle. The first-type glass powder is Pb-Zn-B-O-M glass powder, and the second-type glass powders is Ba-B-O-M glass powder, M is at least one of alkali metal elements; the organic vehicle is a vehicle of organic resin and/or cellulose, and a content of the organic resin and/or the cellulose in the organic vehicle is not higher than 10.0% of a total mass of the organic vehicle. By introducing two different types of glass powder, the contact resistance between the metal grid and the PN junction layer is reduced, thereby obtaining high-performance silver aluminum pastes for N-type Topcon monocrystalline silicon cells and high-efficiency electrode metallization for N-type silicon solar cells.

The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

A high-tension busbar silver paste applied to the N-type solar cell is prepared by mixing a silver powder (a mixture of a spherical silver powder A having a median particle size of 700-900 nm and a tapped density of 5-6 g/mL and a spherical silver powder B having a medium particle size of 280-450 nm and a tapped density of 4-5 g/mL), an organic vehicle (a mixture of 3-5 wt % of polyvinyl butyral resin and 5-10 wt % of acrylic resin as a main resin) and a glass powder (copper-bismuth-manganese-tellurium series glass powder having a medium particle size of 0.7-1 μm and a softening temperature of 600-800° C.); the silver paste has large welding tension, in which the welding tension of the front busbar line is 4 N or more.

A high-tension busbar silver paste applied to the N-type solar cell is prepared by mixing a silver powder (a mixture of a spherical silver powder A having a median particle size of 700-900 nm and a tapped density of 5-6 g/mL and a spherical silver powder B having a medium particle size of 280-450 nm and a tapped density of 4-5 g/mL), an organic vehicle (a mixture of 3-5 wt % of polyvinyl butyral resin and 5-10 wt % of acrylic resin as a main resin) and a glass powder (copper-bismuth-manganese-tellurium series glass powder having a medium particle size of 0.7-1 μm and a softening temperature of 600-800° C.); the silver paste has large welding tension, in which the welding tension of the front busbar line is 4 N or more.

A method of making an electrically conductive and weatherproof enclosure includes mixing and melting an electrically conductive material, a latex rubber material, and a polycarbonate material to produce a weatherproof material mixture, blending carbon black with polyethylene to produce an electrically conductive additive, positioning an injection mold of the enclosure in fluid communication with an exit end of a heating barrel, injecting the weatherproof material mixture into an entry end of the heating barrel, introducing the electrically conductive additive through a lateral port of the heating barrel proximate to the exit end to partially mix with the weatherproof material mixture to produce an injection mixture, and injecting the injection mixture into the injection mold to produce the electrically conductive and weatherproof enclosure.

In a method making a flexible electrical conductor, a mask layer (216) is applied to a substrate (210). A portion of the mask layer (216) is removed to expose the substrate (210) in an exposed shape (220) corresponding to the conductor. A liquid phase conductor (232) is applied to the portion of the substrate (210). The mask layer (216) is dissolved with a solvent (238) to leave a shaped liquid phase conductor (234) corresponding to the exposed shape on the substrate (210). A primary elastomer layer (240) is applied onto the substrate (210) and the shaped liquid phase conductor (234). The primary elastomer layer (240) and the shaped liquid phase conductor (234) are removed from the substrate (210). A secondary elastomer layer (242) is applied to the shaped liquid phase conductor (234) and the primary elastomer layer (240) to seal the shaped liquid phase conductor (234) therein.

In a method making a flexible electrical conductor, a mask layer (216) is applied to a substrate (210). A portion of the mask layer (216) is removed to expose the substrate (210) in an exposed shape (220) corresponding to the conductor. A liquid phase conductor (232) is applied to the portion of the substrate (210). The mask layer (216) is dissolved with a solvent (238) to leave a shaped liquid phase conductor (234) corresponding to the exposed shape on the substrate (210). A primary elastomer layer (240) is applied onto the substrate (210) and the shaped liquid phase conductor (234). The primary elastomer layer (240) and the shaped liquid phase conductor (234) are removed from the substrate (210). A secondary elastomer layer (242) is applied to the shaped liquid phase conductor (234) and the primary elastomer layer (240) to seal the shaped liquid phase conductor (234) therein.

A conducting shear thinning gel composition and methods of making such a composition are disclosed. The conducting shear thinning gel composition includes a mixture of a eutectic gallium alloy and gallium oxide, wherein the mixture of eutectic gallium alloy and gallium oxide has a weight percentage (wt %) of between about 59.9% and about 99.9% eutectic gallium alloy, and a wt % of between about 0.1% and about 2.0% gallium oxide. Also disclosed are articles of manufacture, comprising the shear thinning gel composition, and methods of making article of manufacture having a shear thinning gel composition. Also disclosed are sensors and multiplexed systems utilizing deformable conductors.

A conducting shear thinning gel composition and methods of making such a composition are disclosed. The conducting shear thinning gel composition includes a mixture of a eutectic gallium alloy and gallium oxide, wherein the mixture of eutectic gallium alloy and gallium oxide has a weight percentage (wt %) of between about 59.9% and about 99.9% eutectic gallium alloy, and a wt % of between about 0.1% and about 2.0% gallium oxide. Also disclosed are articles of manufacture, comprising the shear thinning gel composition, and methods of making article of manufacture having a shear thinning gel composition. Also disclosed are sensors and multiplexed systems utilizing deformable conductors.