This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.

An enclosure and a method of making the enclosure is provided that includes mixing stainless steel, rubber, and polycarbonate to produce a material mixture that is electrically conductive. Carbon black powder and polyethylene are blended to produce an electrically resistive additive for dissipating static electricity. At least one injection mold for the enclosure is positioned in fluid communication with an exit end of a heating barrel. The weatherproof material mixture is injected into an entry end of the heating barrel to produce a melted weatherproof material mixture. The electrically resistive additive is introduced through a lateral port of the heating barrel proximate to the exit end to partially mix with the melted weatherproof material mixture to produce an injection mixture. The injection mixture into the at least one injection mold to produce the enclosure that is weatherproof, electrically conductive, and electrically resistive.

The present invention provides a thick-film paste for printing the front-side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal, and a lead-tellurium-oxide dispersed in an organic medium.

The present invention provides a thick-film paste for printing the front-side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal, and a lead-tellurium-oxide dispersed in an organic medium.

Provided is a conductive paste for forming bus bar electrodes having high adhesive strength with respect to a passivation film in a crystalline silicon solar cell without having a detrimental effect on the passivation film so as to affect solar cell properties. The conductive paste is a conductive paste formed on a passivation film of a solar cell, containing: (A) silver particles, (B) an organic vehicle, and (C) glass fit containing TeO.sub.2 at 1.0 mol % to 20 mol % and Bi.sub.2O.sub.3 at 10 mol % to 30 mol %.

Provided is a conductive paste for forming bus bar electrodes having high adhesive strength with respect to a passivation film in a crystalline silicon solar cell without having a detrimental effect on the passivation film so as to affect solar cell properties. The conductive paste is a conductive paste formed on a passivation film of a solar cell, containing: (A) silver particles, (B) an organic vehicle, and (C) glass fit containing TeO.sub.2 at 1.0 mol % to 20 mol % and Bi.sub.2O.sub.3 at 10 mol % to 30 mol %.

A circuit assembly may include a first layer arranged as a substrate, a second layer having a spiral pattern attached to the substrate, wherein the spiral pattern contains a deformable conductor. A circuit assembly may include a first portion of a deformable inductor fabricated on a first layer of the circuit assembly; and a second portion of the deformable inductor fabricated on a second layer of the circuit assembly and electrically connected to the first portion of the deformable inductor. A method may include sensing an interaction with a deformable inductor, wherein the deformable inductor may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor. An article of manufacture may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor.

A circuit assembly may include a first layer arranged as a substrate, a second layer having a spiral pattern attached to the substrate, wherein the spiral pattern contains a deformable conductor. A circuit assembly may include a first portion of a deformable inductor fabricated on a first layer of the circuit assembly; and a second portion of the deformable inductor fabricated on a second layer of the circuit assembly and electrically connected to the first portion of the deformable inductor. A method may include sensing an interaction with a deformable inductor, wherein the deformable inductor may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor. An article of manufacture may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor.

An enclosure and a method of making the enclosure is provided that includes mixing stainless steel, rubber, and polycarbonate to produce a material mixture that is electrically conductive. Carbon black powder and polyethylene are blended to produce an electrically resistive additive for dissipating static electricity. At least one injection mold for the enclosure is positioned in fluid communication with an exit end of a heating barrel. The weatherproof material mixture is injected into an entry end of the heating barrel to produce a melted weatherproof material mixture. The electrically resistive additive is introduced through a lateral port of the heating barrel proximate to the exit end to partially mix with the melted weatherproof material mixture to produce an injection mixture. The injection mixture into the at least one injection mold to produce the enclosure that is weatherproof, electrically conductive, and electrically resistive.

Desirable methods for larger scale silver nanoplate synthesis are described along with methods for applying a noble metal coating onto the silver nanoplates to form coated silver nanoplates with a desirable absorption spectrum. The silver nanoplates are suitable for use in coatings for altering the hue of a transparent film. The hue adjustment can be particularly desirable for transparent conductive films.