Patent classifications
H01B1/16
CONDUCTIVE THICK FILM PASTE FOR SOLAR CELL CONTACTS
The present invention relates to an inorganic reaction system used in the manufacture of electroconductive pastes. The inorganic reaction system comprises a lead containing matrix forming composition and a tellurium oxide additive. Preferably the lead containing matrix forming composition is between 5-95 wt. % of the inorganic reaction system, and the tellurium oxide additive is between 5-95 wt. % of the inorganic reaction system. The lead containing matrix forming composition may be a glass frit, and may comprise lead oxide. Another aspect of the present invention relates to an electroconductive paste composition that comprises metallic particles, an inorganic reaction system as previously disclosed, and an organic vehicle. Another aspect of the present invention relates to an organic vehicle that comprises one or more of a binder, a surfactant, a solvent, and a thixatropic agent. Another aspect of the present invention relates to a solar cell printed with an electroconductive paste composition as disclosed, as well as an assembled solar cell module. Another aspect of the present invention relates to a method of producing a solar cell.
CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH
The present invention provides a thick-film paste composition for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal and a dual-frit oxide composition dispersed in an organic medium.
CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH
The present invention provides a thick-film paste composition for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal and a dual-frit oxide composition dispersed in an organic medium.
Conductive paste composition and semiconductor devices made therewith
A conductive paste composition contains a source of an electrically conductive metal, a boron lithium tellurium oxide, and an organic vehicle. An article such as a high-efficiency photovoltaic cell is formed by a process of deposition of the paste composition on a semiconductor device substrate (e.g., by screen printing) and firing the paste to remove the organic vehicle and sinter the metal and establish electrical contact between it and the substrate.
Conductive paste composition and semiconductor devices made therewith
A conductive paste composition contains a source of an electrically conductive metal, a boron lithium tellurium oxide, and an organic vehicle. An article such as a high-efficiency photovoltaic cell is formed by a process of deposition of the paste composition on a semiconductor device substrate (e.g., by screen printing) and firing the paste to remove the organic vehicle and sinter the metal and establish electrical contact between it and the substrate.
Oxidation-resistant conductive copper paste, method for preparation thereof and method for manufacturing conductive film
The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.
Oxidation-resistant conductive copper paste, method for preparation thereof and method for manufacturing conductive film
The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.
Thick film paste and use thereof
A thick film paste comprising at least one particulate platinum (alloy), at least one metal compound, and an organic vehicle, wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO.sub.2, RuO.sub.2, Rh.sub.2O.sub.3, IrO.sub.2, Cu.sub.2O, CuO, TiO.sub.2, ZrO.sub.2, PbO, SnO.sub.2, CeO.sub.2, Al.sub.2O.sub.3, MgO, MnO.sub.2 and MoO.sub.2, and metal compounds capable of forming a metal oxide on firing, the metal oxide being selected from the group consisting of NiO, SiO.sub.2, RuO.sub.2, Rh.sub.2O.sub.3, IrO.sub.2, Cu.sub.2O, CuO, TiO.sub.2, ZrO.sub.2, PbO, SnO.sub.2, CeO.sub.2, Al.sub.2O.sub.3, MgO, MnO.sub.2 and MoO.sub.2.
COPPER-CONTAINING CONDUCTIVE PASTES AND ELECTRODES MADE THEREFROM
Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.
SILVER NANOWIRE-MESH (AG NW-MESH) ELECTRODE AND MANUFACTURING METHOD THEREOF
According to one aspect of the present invention, a silver nanowire mesh (Ag NW-mesh) electrode and a fabricating method thereof. The Ag NW-mesh electrode includes a flexible substrate; and a mesh pattern layer which is disposed on the flexible substrate and in which a plurality of first meal lines and a plurality of second metal lines are composed of Ag NWs and intersect each other in an orthogonal or diagonal direction to form a grid pattern, wherein the first metal lines and the second metal lines of the mesh pattern layer form an angle of 35 degrees to 55 degrees with respect to a bending direction.