Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

There is disclosed a transferable composition being applicable to a membrane serving to transfer a pattern of the composition to an intended substrate. The transferable composition comprises a swellable polymer swelled by a swelling agent and particles dispersed therein. Methods of preparing the composition, applying it to a transfer membrane as a pattern, and transferring the pattern to a substrate, as well as articles made thereby, are also provided. The transferred patterns may serve a decorative and/or functional purpose and the transferable compositions may accordingly include decorative and/or functional particles. When the functional particles are or can be rendered electrically conductive, a pattern formed therewith can be part of a conductive circuit and can serve, for example, for the manufacturing of a solar cell.

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

A copper paste for joining contains metal particles and a dispersion medium, in which the copper paste for joining contains copper particles as the metal particles, and the copper paste for joining contains dihydroterpineol as the dispersion medium. A method for manufacturing a joined body is a method for manufacturing a joined body which includes a first member, a second member, and a joining portion that joins the first member and the second member, the method including: a first step of printing the above-described copper paste for joining to at least one joining surface of the first member and the second member to prepare a laminate having a laminate structure in which the first member, the copper paste for joining, and the second member are laminated in this order; and a second step of sintering the copper paste for joining of the laminate.

A conductive resin composition has low-temperature curability and is excellent in resistance stability during stretching. A conductive resin composition contains: (A) a polyorganosiloxane having an alkenyl group, (B) a polyorganosiloxane having a specific structure, (C) a conductive particle, (D) a compound having a hydrosilyl group, and (E) a hydrosilylation catalyst.
The content of the component (B) is 6 to 50 parts by mass based on 100 parts by mass of the component (A).

A conductive resin composition has low-temperature curability and is excellent in resistance stability during stretching. A conductive resin composition contains: (A) a polyorganosiloxane having an alkenyl group, (B) a polyorganosiloxane having a specific structure, (C) a conductive particle, (D) a compound having a hydrosilyl group, and (E) a hydrosilylation catalyst.
The content of the component (B) is 6 to 50 parts by mass based on 100 parts by mass of the component (A).

A surface protection composition contains (a) a phosphorus compound represented by formula (1), (b-1) a metal-containing compound or (b-2) an amine compound, (c) a (meth)acrylate having a hydrocarbon chain having 4 or more carbon atoms, (d-1) an acylphosphine oxide photopolymerization initiator and (d-2) an α-aminoacetophenone photopolymerization initiator. Further, the composition has the compound (d-1) in an amount of 0.1 to 3.0 mass % with respect to the total amount of the composition, compound (d-2) in an amount of 0.1 to 3.0 mass % with respect to the total amount of the composition and a total amount of the compound (d-1) and (d-2) is less than 5.0 mass % with respect to the total amount of the composition.

##STR00001##

In the above formula, R.sup.1 represents a hydrogen atom, R.sup.2 represents a hydrocarbon group having 4 to 30 carbon atoms, and R.sup.3 represents a hydrogen atom or a hydrocarbon group having 4 to 30 carbon atoms.

A surface protection composition contains (a) a phosphorus compound represented by formula (1), (b-1) a metal-containing compound or (b-2) an amine compound, (c) a (meth)acrylate having a hydrocarbon chain having 4 or more carbon atoms, (d-1) an acylphosphine oxide photopolymerization initiator and (d-2) an α-aminoacetophenone photopolymerization initiator. Further, the composition has the compound (d-1) in an amount of 0.1 to 3.0 mass % with respect to the total amount of the composition, compound (d-2) in an amount of 0.1 to 3.0 mass % with respect to the total amount of the composition and a total amount of the compound (d-1) and (d-2) is less than 5.0 mass % with respect to the total amount of the composition.

##STR00001##

In the above formula, R.sup.1 represents a hydrogen atom, R.sup.2 represents a hydrocarbon group having 4 to 30 carbon atoms, and R.sup.3 represents a hydrogen atom or a hydrocarbon group having 4 to 30 carbon atoms.

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.