A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt.% gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt.% gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

Load-bearing apparatus/systems for location in the vicinity of energized power lines are provided. The apparatus includes a base member. The base member has an upper layer and a backing surface layer. An uppermost surface of the upper layer is adapted to support on it at least power line workers and/or related stringing equipment. At least the uppermost surface of the upper layer is adapted to be electrically conductive. Methods for forming the apparatus are also provided.

Load-bearing apparatus/systems for location in the vicinity of energized power lines are provided. The apparatus includes a base member. The base member has an upper layer and a backing surface layer. An uppermost surface of the upper layer is adapted to support on it at least power line workers and/or related stringing equipment. At least the uppermost surface of the upper layer is adapted to be electrically conductive. Methods for forming the apparatus are also provided.

A silver-silver chloride electrode contains silicone rubber as a binder in which silver powder, silver chloride powder and silica powder are dispersed. A current density of a current flowing through an electric circuit is equal to or greater than 0.64 μA/mm.sup.2 after 5 minutes from the beginning of voltage application to the electric circuit when the electric circuit in which two silver-silver chloride electrodes and a phosphate buffered saline are connected in series is made up of the two silver-silver chloride electrodes and the phosphate buffered saline containing no calcium and no magnesium interposed between the two silver-silver chloride electrodes.

A moldable interconnect device for providing an electrical connection between two or more opposing arrays of contacts for establishing an electrical circuit. The moldable interconnect device having an insulting substrate and an array of conductive elements held in the insulating substrate, the conductive elements are made of an elastomeric conductive composite. The composite having a polymeric matrix comprising a crosslinked polymer. The polymer having a curing agent for catalyzing crosslinking of the polymer matrix and conductive metal particles and non-conductive compressible rubber particles dispersed with the polymer matrix. The non-conductive compressible rubber particles having a greater compressibility than the elastomeric conductive composite that is the same as the elastomeric conductive composite but free of non-conductive compressible rubber particles.

A moldable interconnect device for providing an electrical connection between two or more opposing arrays of contacts for establishing an electrical circuit. The moldable interconnect device having an insulting substrate and an array of conductive elements held in the insulating substrate, the conductive elements are made of an elastomeric conductive composite. The composite having a polymeric matrix comprising a crosslinked polymer. The polymer having a curing agent for catalyzing crosslinking of the polymer matrix and conductive metal particles and non-conductive compressible rubber particles dispersed with the polymer matrix. The non-conductive compressible rubber particles having a greater compressibility than the elastomeric conductive composite that is the same as the elastomeric conductive composite but free of non-conductive compressible rubber particles.

Provided is a transparent conducting film having a preferable optical property, a preferable electrical property, and further, a superior durability of folding. The transparent conducting film comprises a transparent substrate and a transparent conducting layer formed on at least one of main faces of the transparent substrate, wherein the transparent conducting layer contains a binder resin and a conducting fiber, a cut portion of the transparent conducting film has a straightness of 0.050 mm or less. Preferably, the transparent substrate is a resin film having an elongated resin film or cut out from an elongated film, and can be folded in with a folding axis in the direction perpendicular to the longitudinal direction of the elongated resin film.

Provided is a transparent conducting film having a preferable optical property, a preferable electrical property, and further, a superior durability of folding. The transparent conducting film comprises a transparent substrate and a transparent conducting layer formed on at least one of main faces of the transparent substrate, wherein the transparent conducting layer contains a binder resin and a conducting fiber, a cut portion of the transparent conducting film has a straightness of 0.050 mm or less. Preferably, the transparent substrate is a resin film having an elongated resin film or cut out from an elongated film, and can be folded in with a folding axis in the direction perpendicular to the longitudinal direction of the elongated resin film.

A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.