To provide a metal particle composition having excellent oxidation resistance, which does not require a transition metal catalyst and can be applied to existing metal particles, a method for producing the metal particle composition, and a paste. The metal particle composition contains, with respect to 100 parts by mass of metal particles, 0.1 to 5 parts by mass of a compound (A) having a structure represented by the following general formula (I):

##STR00001## in which R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, or an aralkyl group, R.sup.3 and R.sup.4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group, an alkenyl group having 2 to 6 carbon atoms, an alkenyloxy group, an aryl group, or an aralkyl group.

To provide a metal particle composition having excellent oxidation resistance, which does not require a transition metal catalyst and can be applied to existing metal particles, a method for producing the metal particle composition, and a paste. The metal particle composition contains, with respect to 100 parts by mass of metal particles, 0.1 to 5 parts by mass of a compound (A) having a structure represented by the following general formula (I):

##STR00001## in which R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, or an aralkyl group, R.sup.3 and R.sup.4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group, an alkenyl group having 2 to 6 carbon atoms, an alkenyloxy group, an aryl group, or an aralkyl group.

A photosensitive transfer material including a temporary support, and a photosensitive layer that contains a binder polymer and a compound A containing at least one group selected from the group consisting of a metal reducing group and a metal coordinating group and a method of producing the same, a method of producing a patterned metal conductive material using the photosensitive transfer material, a film including a metal and a resin layer that contains the compound A, a touch panel including the film, and a method of suppressing deterioration in which in a film including a metal and a resin layer, the resin layer contains the compound A.

A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B), wherein the coating of the coated silver particles (A) comprises silver acetylacetonate (silver 2,4-pentanedionate) and/or at least one silver salt of the formula C.sub.nH.sub.2n+1COOAg with n being an integer in the range of 7 to 10, and wherein the at least one silver salt is thermally decomposable at >160° C.

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

A silver powder containing: silver particles; and an adherent that is attached to surfaces of the silver particles and contains a metal oxide that has a melting point lower than a melting point of silver.

A silver powder containing: silver particles; and an adherent that is attached to surfaces of the silver particles and contains a metal oxide that has a melting point lower than a melting point of silver.

To provide a thick film resistor paste for a resistor having no abnormalities of cracks in appearance and sufficient surge resistance, especially for low resistance, while using lead borosilicate glass, a thick film resistor using the thick film resistor paste, and an electronic component provided with the thick film resistor. A thick film resistor paste comprises a ruthenium-oxide-containing glass powder and an organic vehicle, the ruthenium-oxide-containing glass powder comprises 10 to 60 mass % of ruthenium oxide, a glass composition of the ruthenium-oxide-containing glass powder comprises 60 mass % or less of silicon oxide, 30 to 90 mass % of lead oxide, 5 to 50 mass % of boron oxide relative to 100 mass % of glass components, and, a combined amount of silicon oxide, lead oxide and boron oxide by mass % is 50 mass % or more relative to 100 mass % of the glass components.

A method for prepares low melting point metal particles, a conductive paste and a method for preparing the conductive paste, and relates to the technical field of functional materials. The method for preparing low melting point metal particles includes providing an organic resin carrier having fluidity, adding a low melting point metal material and the organic resin carrier into a sealed container for a vacuuming operation or filling a protective gas, making a temperature in the sealed container higher than the melting point of the low melting point metal and performing dispersion by stirring, and lowering the temperature, after performing the dispersion, to be below the melting point of the low melting point metal with continuous stirring during a cooling process to obtain low melting point metal particles dispersed in the organic resin carrier. Low melting point metal particles can be effectively prepared.