H01B1/22

Electrically conductive surface and a process for producing the same

Load-bearing apparatus/systems for location in the vicinity of energized power lines are provided. The apparatus includes a base member. The base member has an upper layer and a backing surface layer. An uppermost surface of the upper layer is adapted to support on it at least power line workers and/or related stringing equipment. At least the uppermost surface of the upper layer is adapted to be electrically conductive. Methods for forming the apparatus are also provided.

Electrically conductive surface and a process for producing the same

Load-bearing apparatus/systems for location in the vicinity of energized power lines are provided. The apparatus includes a base member. The base member has an upper layer and a backing surface layer. An uppermost surface of the upper layer is adapted to support on it at least power line workers and/or related stringing equipment. At least the uppermost surface of the upper layer is adapted to be electrically conductive. Methods for forming the apparatus are also provided.

CONTACT MEMBER, CONNECTOR, COMPOSITION, AND METHOD FOR PRODUCING CONTACT MEMBER
20220416460 · 2022-12-29 ·

The present invention provides a contact member that strikes a balance between low electrical resistance and sliding durability under the condition of load as low as about 0.1 N. A contact member of the invention has a metal base and a coating disposed on at least part of the metal base. The coating contains fluorinated oil having a polar group, and metal particles surface-treated with a fluorine-based compound having a polar group.

Copper paste for pressureless bonding, bonded body and semiconductor device

A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.

Stretchable wiring film and method for forming the same
11530312 · 2022-12-20 · ·

A stretchable wiring film includes: (A) a stretchable film made of, at least as a top surface of the stretchable film, a cured product of a stretchable film material containing a silicone polyurethane resin; and (B) a stretchable wiring. The top surface of the stretchable film has a repeated uneven pattern formed with depths of 0.1 μm to 5 mm and pitches of 0.1 μm to 10 mm. The stretchable wiring is formed on the top surface of the stretchable film where the repeated uneven pattern is formed. Thus, the present invention provides: a stretchable wiring film having less decrease in electric conductivity in stretching and excellent water repellency on the film top surface; and a method for forming the stretchable wiring film.

Stretchable wiring film and method for forming the same
11530312 · 2022-12-20 · ·

A stretchable wiring film includes: (A) a stretchable film made of, at least as a top surface of the stretchable film, a cured product of a stretchable film material containing a silicone polyurethane resin; and (B) a stretchable wiring. The top surface of the stretchable film has a repeated uneven pattern formed with depths of 0.1 μm to 5 mm and pitches of 0.1 μm to 10 mm. The stretchable wiring is formed on the top surface of the stretchable film where the repeated uneven pattern is formed. Thus, the present invention provides: a stretchable wiring film having less decrease in electric conductivity in stretching and excellent water repellency on the film top surface; and a method for forming the stretchable wiring film.

Solvents and slurries comprising a poly(carboxylic acid) binder for silicon electrode manufacture

A binder solution for manufacturing silicon-based anodes useful for lithium-ion electrochemical cells is described herein. The binder solution comprises a poly(carboxylic acid) binder dissolved in a mixed solvent system comprising an amide solvent of Formula I, as described herein, and a second solvent which can be water and/or an organic solvent. The binder preferably comprises poly(acrylic acid). The mixed solvent system comprises about 10 to about 99 vol % of the amide solvent of Formula I. The binder solution is utilized as a solvent for a slurry of silicon-containing particles for preparing a silicon-containing electrode. The slurries made with the mixed solvent systems have higher viscosity and are more stable than slurries containing the same concentrations of silicon particle, carbon particles, and binder in water as the sole solvent.

Solvents and slurries comprising a poly(carboxylic acid) binder for silicon electrode manufacture

A binder solution for manufacturing silicon-based anodes useful for lithium-ion electrochemical cells is described herein. The binder solution comprises a poly(carboxylic acid) binder dissolved in a mixed solvent system comprising an amide solvent of Formula I, as described herein, and a second solvent which can be water and/or an organic solvent. The binder preferably comprises poly(acrylic acid). The mixed solvent system comprises about 10 to about 99 vol % of the amide solvent of Formula I. The binder solution is utilized as a solvent for a slurry of silicon-containing particles for preparing a silicon-containing electrode. The slurries made with the mixed solvent systems have higher viscosity and are more stable than slurries containing the same concentrations of silicon particle, carbon particles, and binder in water as the sole solvent.

ELONGATED ELASTIC SEAM TAPE WITH ELECTRICAL CONDUCTOR

The present invention relates to an elongated elastic seam tape comprising an elongated elastic conductor as well as to a method of manufacturing such an elongated elastic seam tape.

INK BASED ON SILVER NANOPARTICLES

The present invention relates to formulations of ink based on nanoparticles of silver and of metal oxides. In particular, the present invention relates to formulations of ink based on nanoparticles of silver and of metal oxides, said inks being stable, having improved conductivity and making it possible to advantageously form electrodes and/or conductive tracks that are particularly suitable for photovoltaic cells, for example on a silicon and/or glass substrate.