An impregnate with antistatic properties for use in laminates or for coating wood-based panels is disclosed. A resin used for impregnating and/or coating paper may include carbon-based particles, at least one compound of the general formula (Ia) R.sup.1.sub.aSiX.sub.(4-a), R.sup.3.sub.cSiX.sub.(4-c) (II), and inorganic particles. X is methoxy, ethoxy, n-propoxy or i-propoxy. R.sup.1 is an organic radical selected from the group including methyl, ethyl, propyl, or vinyl, and has at least one functional group Q.sub.1, selected from the group including acrylic, acryloxy, methacrylic, methacyloxy, or epoxy. R.sup.3 is a non-hydrolyzable organic radical selected from the group including C1-C10 alky, C6-10 aryl, wherein C is 1, 2, or 3, and the inorganic particles have a size between 2 nm and 400 nm.

An impregnate with antistatic properties for use in laminates or for coating wood-based panels is disclosed. A resin used for impregnating and/or coating paper may include carbon-based particles, at least one compound of the general formula (Ia) R.sup.1.sub.aSiX.sub.(4-a), R.sup.3.sub.cSiX.sub.(4-c) (II), and inorganic particles. X is methoxy, ethoxy, n-propoxy or i-propoxy. R.sup.1 is an organic radical selected from the group including methyl, ethyl, propyl, or vinyl, and has at least one functional group Q.sub.1, selected from the group including acrylic, acryloxy, methacrylic, methacyloxy, or epoxy. R.sup.3 is a non-hydrolyzable organic radical selected from the group including C1-C10 alky, C6-10 aryl, wherein C is 1, 2, or 3, and the inorganic particles have a size between 2 nm and 400 nm.

The present disclosure provides a conductive material, a method for manufacturing the conductive material and an electronic device, and relates to the technical field of new materials. The conductive material provided by the present disclosure includes: a first component and a second component. The first component includes a liquid metal having a melting point below room temperature, a coating material, and a first solvent. The coating material coats liquid metal droplets formed by the liquid metal. The second component includes a base resin and a conductive powder. The first component and the second component are weighed in proportion, and are uniformly mixed to obtain the conductive material. The technical solution of the present disclosure can obtain a wire having better flexibility.

The present invention relates to an electrically conductive composition comprising a) a resin selected from nitrocellulose, chlorinated polyester, chlorinated polyether, chlorinated polyvinyl, chlorinated polyacetate and mixtures thereof; b) electrically conductive particles comprising graphite and carbon black, wherein ratio of said graphite and said carbon black is from 1:1 to 5:1; and c) a solvent, where in ratio of said electrically conductive particles and said resin is from 0.20:1 to 4:1. The compositions according to the present invention can be used in high-speed printing techniques such as flexography and rotogravure printing.

The invention relates to a method for forming an article comprising a pathway of particles wherein a termination of the pathway of particles is exposed. The method comprises arranging the particles by applying an electric field and/or a magnetic field at an interface between a water soluble or a non-water soluble matrix and a matrix comprising a viscous material and particles. After fixating the viscous material, the termination is exposed by dissolving the water soluble or non-water soluble matrix. The invention also relates to articles obtainable by said method, and to the use of said method in various applications.

The invention relates to a method for forming an article comprising a pathway of particles wherein a termination of the pathway of particles is exposed. The method comprises arranging the particles by applying an electric field and/or a magnetic field at an interface between a water soluble or a non-water soluble matrix and a matrix comprising a viscous material and particles. After fixating the viscous material, the termination is exposed by dissolving the water soluble or non-water soluble matrix. The invention also relates to articles obtainable by said method, and to the use of said method in various applications.

The present disclosure is directed to multiphase dispersions and nanaocomposites comprised of continuous matrix or binder and endohedrally impregnated cellular carbon filler. These nanocomposites may exhibit superior mechanical, electrical, thermal, or other properties, and may be used in a variety of products, including hierarchical fiber-reinforced composites with nanocomposite matrices.

The present disclosure is directed to multiphase dispersions and nanaocomposites comprised of continuous matrix or binder and endohedrally impregnated cellular carbon filler. These nanocomposites may exhibit superior mechanical, electrical, thermal, or other properties, and may be used in a variety of products, including hierarchical fiber-reinforced composites with nanocomposite matrices.

A resin molded product whose main component consists of an ethylene-vinyl acetate copolymer resin and carbon black. The ethylene-vinyl acetate copolymer resin has an MFR of 0.5 g/10 min or more and 20 g/10 min or less. The carbon black has an average primary particle diameter of 55 nm or more and 100 nm or less and a DBP oil absorption amount of 100 mL/100 g or more and 300 mL/100 g or less. The content of vinyl acetate is 2.9 parts by mass or more and 12.3 parts by mass or less based on 100 parts by mass of the main component. The resin molded product has a surface resistivity of 720 Ω/□ or less.

A resin molded product whose main component consists of an ethylene-vinyl acetate copolymer resin and carbon black. The ethylene-vinyl acetate copolymer resin has an MFR of 0.5 g/10 min or more and 20 g/10 min or less. The carbon black has an average primary particle diameter of 55 nm or more and 100 nm or less and a DBP oil absorption amount of 100 mL/100 g or more and 300 mL/100 g or less. The content of vinyl acetate is 2.9 parts by mass or more and 12.3 parts by mass or less based on 100 parts by mass of the main component. The resin molded product has a surface resistivity of 720 Ω/□ or less.