A dielectric composite material includes an electrical insulator and primary nanoparticles. The primary nanoparticles are dispersed, without forming agglomerates, within the electrical insulator. The primary nanoparticles are of one more of the following types: aluminum, aluminum oxide, or aluminum coated with a surface oxide layer, and the electrical insulator being a dissimilar material from the primary nanoparticles

A resistor includes materials including copper, nickel, and lanthanum boride. A content of the materials is 40% by mass or more with respect to a total material content of the resistor. The copper includes copper particles having a particle diameter of 2.5 m or more. In addition, a circuit board includes a substrate, the resistor on the substrate, a metal layer on the resistor and a glass layer on the resistor. Further, an electronic device includes the circuit board and an electronic component on the metal layer.

A semiconductive polymer composition comprising: (a) an ethylene alkyl (meth) acrylate copolymer; (b) 15 to 48 wt % carbon black having an iodine adsorption number of 85 to 140 mg/g (ASTM D 1510-19a), an oil absorption number of 90 to 110 ml/100 g (ASTM D 2414-19) and an average primary particle size of 29 nm or less (ASTM D 3849-14a); and (c) 0.05 to 2.0 wt % of 4,4-bis(1,1-dimethylbenzyl)diphenylamine; all weight percentages being based on the total weight of the semiconductive polymer composition.

A semiconductive polymer composition comprising: (a) an ethylene C1-2-alkyl (meth)acrylate copolymer having an MFR2 of 4.5 g/10 min or more and a C1-2-alkyl (meth)acrylate content of at least 9.0 wt % based on the total weight of the ethylene C1-2-alkyl alkyl (meth)acrylate copolymer; (b) 35.0 to 48 wt % carbon black having an iodine adsorption number of 85 to 140 mg/g (ASTM D 1510-19a), an oil absorption number of 90 to 110 ml/100 g (ASTM D 2414-19) and an average primary particle size of 29 nm or less (ASTM D 3849-14a); and (c) 0.05 to 2.0 wt % of at least one antioxidant; all weight percentages being based on the total weight of the semiconductive polymer composition, unless mentioned otherwise.

A composite material that includes a layer of reinforcing fibres impregnated with a curable resin matrix and a plurality of electrically conductive composite particles positioned adjacent or in proximity to the reinforcing fibers. Each of the electrically conductive composite particles is composed of a conductive component and a polymeric component, wherein the polymeric component includes one or more polymers that are initially in a solid phase and are substantially insoluble in the curable resin, but is able to undergo at least partial phase transition to a fluid phase during a curing cycle of the composite material.

A method includes depositing a polymeric electrical insulation layer about at least a portion of a length of an electrical conductor that includes copper, depositing a barrier layer, which includes a sol-gel layer, about at least a portion of the polymeric electrical insulation layer to form at least a portion of a coated electrical conductor, and forming a submersible component that includes at least a portion of the coated electrical conductor.

Organoclays are added to semiconductive compositions to provide a reduction in the dielectric losses of layered composites in which the semiconductive layer contains species which could migrate into the insulation and result in undesirably high dielectric losses. The invention semiconductive compositions provide improved performance in power cable applications.

This invention relates to a technique that uses an externally applied electric field to self-assemble monolayers of mixtures of particles into molecular-like hierarchical arrangements on fluid-liquid interfaces. The arrangements consist of composite particles which are arranged in a pattern. The structure of a composite particle depends on factors such as the relative sizes of the particles and their polarizabilities, and the electric field intensity. If the particles sizes differ by a factor of two or more, the composite particle has a larger particle at its core and several smaller particles form a ring around it. The number of particles in the ring and the spacing between the composite particles depend on their polarizabilities and the electric field intensity. Approximately same sized particles form chains in which positively and negatively polarized particles alternate, and when their polarizabilities are comparable they form tightly packed crystals.

The invention relates to an insulation element (1) with low electrical conductivity for the electrical insulation of an electrotechnical component in the high voltage range. The insulation element (1) comprises artificial fibres (2) and electrically conductive particles (3) having an electrically non-conductive core (5) and an electrically conductive or semi-conductive cladding (6) surrounding the core (5). Moreover, the insulation element (1) comprises a cationic polymer (4).

An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.