Embodiments are directed to a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material and an intermediate or second layer adjacently positioned with respect to the dielectric material. The intermediate layer or second layer is comprised of a conductor and fiberglass strands, with the fiberglass strands having an associated orientation. When assembled, the fiberglass and the conductor having a matching orientation and separation distance from a source to a destination.

A glass-ceramic-ferrite composition contains glass, a ceramic filler, and NiZnCu ferrite. The glass contains about 0.5% by weight or more of R.sub.2O, where R is at least one selected from the group consisting of Li, Na, and K; about 5.0% by weight or less of Al.sub.2O.sub.3; about 10.0% by weight or more of B.sub.2O.sub.3; and about 85.0% by weight or less of SiO.sub.2 on the basis of the weight of the glass. The NiZnCu ferrite accounts for about 58% to 64% by weight of the glass-ceramic-ferrite composition. The ceramic filler contains quartz and, in some cases, forsterite. The quartz accounts for about 4% to 13% by weight of the glass-ceramic-ferrite composition. The forsterite accounts for about 6% by weight or less of the glass-ceramic-ferrite composition.

Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix.

Embodiments are directed to a printed circuit board and a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material, an intermediate layer positioned adjacent to the dielectric material, and a conductor positioned adjacent to the intermediate layer. The intermediate layer is comprised of fiberglass strands having an associated orientation. When assembled, the fiberglass of the intermediate layer and the conductor having a matching orientation and separation distance from a source to a destination.

Embodiments are directed to a printed circuit board and a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material, an intermediate layer positioned adjacent to the dielectric material, and a conductor positioned adjacent to the intermediate layer. The intermediate layer is comprised of fiberglass strands having an associated orientation. When assembled, the fiberglass of the intermediate layer and the conductor having a matching orientation and separation distance from a source to a destination.

A cable includes a conductor and a first semiconductive layer arranged in a radially outer position with respect to the conductor. An insulating layer is arranged in a radially outer position with respect to the first semiconductive layer. A second semiconductive layer is arranged in a radially outer position with respect to the insulating. A conductive screen is arranged in a radially outer position with respect to the second semiconductive layer. A heat block layer is arranged in a radially outer position with respect to the conductive screen. The heat block layer includes a layer made of a fire resistant or a flame retardant halogen-free material. A rubberized glass fiber tape is arranged in a radially outer position with respect to the heat block layer. An outer sheath is arranged in a radially outer position with respect to the rubberized glass fiber tape.

A glass powder of the present invention is a glass powder, which is formed of alkali borosilicate glass, wherein the glass powder includes 0.1 mol % to 1.0 mol %, provided that 1.0 mol % is excluded, of Li.sub.2O+Na.sub.2O+K.sub.2O in a glass composition, has a molar ratio Li.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.35 to 0.65, a molar ratio Na.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.25 to 0.55, and a molar ratio K.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.025 to 0.20, and has a specific dielectric constant at 25? C. and 16 GHz of from 3.5 to 4.0 and a dielectric dissipation factor at 25? C. and 16 GHz of 0.0020 or less.

A glass powder of the present invention is a glass powder, which is formed of alkali borosilicate glass, wherein the glass powder includes 0.1 mol % to 1.0 mol %, provided that 1.0 mol % is excluded, of Li.sub.2O+Na.sub.2O+K.sub.2O in a glass composition, has a molar ratio Li.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.35 to 0.65, a molar ratio Na.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.25 to 0.55, and a molar ratio K.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.025 to 0.20, and has a specific dielectric constant at 25? C. and 16 GHz of from 3.5 to 4.0 and a dielectric dissipation factor at 25? C. and 16 GHz of 0.0020 or less.

A fire resistant corrugated coaxial cable is described that employs a high-temperature, insulating alkaline earth silicate (AES) wool dielectric. The AES wool dielectric is devoid of water as a constituent. The AES wool may be survivable under conditions of high heat, such as temperatures specified by common fire test standards (e.g., 1850? F./1010? C. for two hours). The cable is configured to maintain a relatively coaxial relation between a center conductor and an outer conductor even under aforementioned fire tests. A layer of ceramifiable silicone rubber or refractory fiber wrap can surround the outer conductor and continues to insulate it from the outside if a low-smoke zero-halogen (LSZH) jacket burns away.

In one aspect, the disclosure relates to multi-material fibers capable of distributedly measuring temperature and pressure in which the methods comprise a thermal drawing step, and the methods of fabricating the disclosed fibers. The fibers can be utilized in methods of temperature and pressure mapping or sensing comprising electrical reflectometry for interrogation. Further disclosed are devices comprising a disclosed fiber with the multi-point detection capability with simple one-end connection. Also disclosed are articles, e.g., smart clothing, wound dressing, robotic skin and other industrial products, comprising a disclosed fiber or a fabric comprising a disclosed fiber. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.