A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250 C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250 C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250 C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250 C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.

A dielectric composition includes one of BaTiO.sub.3, (Ba,Ca)(Ti,Ca)O.sub.3, (Ba,Ca)(Ti,Zr)O.sub.3, Ba(Ti,Zr)O.sub.3 and (Ba,Ca)(Ti,Sn)O.sub.3, as a main component, a first subcomponent including a rare earth element, and a second subcomponent including at least one of a variable valence acceptor element and a fixed valence acceptor element. When a sum of contents of the rare earth element is defined as DT and a sum of contents of the variable valence acceptor element and the fixed valence acceptor element is defined as AT, (DT/AT)/(Ba+Ca) satisfies more than 0.5 and less than 6.0. In addition, a multilayer electronic component including the dielectric composition is provided.

A dielectric composition includes one of BaTiO.sub.3, (Ba,Ca)(Ti,Ca)O.sub.3, (Ba,Ca)(Ti,Zr)O.sub.3, Ba(Ti,Zr)O.sub.3 and (Ba,Ca)(Ti,Sn)O.sub.3, as a main component, a first subcomponent including a rare earth element, and a second subcomponent including at least one of a variable valence acceptor element and a fixed valence acceptor element. When a sum of contents of the rare earth element is defined as DT and a sum of contents of the variable valence acceptor element and the fixed valence acceptor element is defined as AT, (DT/AT)/(Ba+Ca) satisfies more than 0.5 and less than 6.0. In addition, a multilayer electronic component including the dielectric composition is provided.

A processing technology of a busbar for a new energy automobile comprises the following steps: first step: punching a raw material blank of a busbar to obtain a busbar base material; second step: spraying high-temperature-resistant insulating paint on part or whole of an outer surface of the busbar base material obtained in the first step; and third step: drying to obtain a busbar. The busbar of the present invention has simple processing technology.

A variable transmission medium comprises a fluid and a plurality of nanoparticles dispersed in the fluid, wherein addition of acid to the fluid causes the nanoparticles to flocculate and form aggregates of particles that scatter light. The nanoparticles may comprise at least one metal oxide, such as titanium dioxide, zinc oxide or zirconium dioxide. The fluid may have a dielectric constant less than about 10. The medium may be used in, for example, privacy glass for a conference room.

A variable transmission medium comprises a fluid and a plurality of nanoparticles dispersed in the fluid, wherein addition of acid to the fluid causes the nanoparticles to flocculate and form aggregates of particles that scatter light. The nanoparticles may comprise at least one metal oxide, such as titanium dioxide, zinc oxide or zirconium dioxide. The fluid may have a dielectric constant less than about 10. The medium may be used in, for example, privacy glass for a conference room.

A dielectric composition contains a complex oxide represented by a composition formula of Bi.sub.xZn.sub.yNb.sub.zO.sub.1.75+. x+y+z=1.00. x<0.20. 0.20y0.50. 0.25x/z. A dielectric composition contains a complex oxide represented by a composition formula of Bi.sub.xZn.sub.yNb.sub.zO.sub.1.75+. x+y+z=1.00. 0.20y0.50. 1.5<x/z3.0. z<0.25.