H01B3/12

SINTERED BODY, METHOD FOR PRODUCING SAME, AND DIELECTRIC COMPOSITION

A sintered body containing polycrystalline grains of a metal oxynitride containing at least two metal elements, wherein Ba and at least one metal element of a crystal phase of the sintered body are contained in a triple point that is not a void between the polycrystalline grains. A method for producing the sintered body includes sintering a mixture of at least a metal oxynitride as a main component and a sintering aid containing cyanamide in an atmosphere containing nitrogen or a rare gas or in a reduced-pressure atmosphere of 10 Pa or less while applying a mechanical pressure with a retention time at a maximum heating temperature during the sintering set to 1 minute to 10 minutes.

DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT

A dielectric ceramic composition contains dielectric particles containing a main component represented by a composition formula (Ba.sub.1-x-ySr.sub.xCa.sub.y).sub.m(Ti.sub.1-zZr.sub.z)O.sub.3 and grain boundaries present between the dielectric particles. The values of m, x, y, and z in the composition formula are all molar ratios. In the composition formula, 0.9≤m≤1.4, 0≤x<1.0, 0<y≤1.0, 0.9≤(x+y)≤1.0, and 0.9≤z≤1.0 are satisfied. The dielectric particles contain specific structural particles having a predetermined intragranular structure, and each of the specific structural particles intragranularly includes a first region and a second region having different Ca concentrations from each other. C2/C1 is less than 0.8 in which C1 is an average value of the Ca concentration in the first region and C2 is an average value of the Ca concentration in the second region.

SPHERICAL SILICA POWDER
20220169832 · 2022-06-02 · ·

A spherical silica powder with a low dielectric tangent, wherein after formulating the spherical silica powder in a resin and molding it into a sheet, in a dielectric tangent of the spherical silica powder calculated by using he following Formula (I) based on a dielectric tangent (tan δc) of the sheet which is measured under the conditions a frequency is 35-40 GHz with a resonator method, B/A is 0.70 or lower, wherein “A” represents a dielectric tangent (tan δf.sub.A) of the spherical silica powder before a dielectric tangent reduction treatment and “B” represents a dielectric tangent (tan δf.sub.B) of the spherical silica powder after a dielectric tangent reduction treatment; and a specific surface area of said spherical silica powder after a dielectric tangent reduction treatment is 1-30 m.sup.2/g.

HIGH Q MODIFIED BARIUM-BASED MATERIALS FOR HIGH FREQUENCY APPLICATIONS
20220162087 · 2022-05-26 ·

Disclosed are embodiments of high Q modified materials. In some embodiments, complex tungsten oxides and/or hexagonal perovskite crystal structures can be added to provide for advantageous properties. In some embodiments, no tin is used in the formation of the material.

HIGH Q MODIFIED BARIUM-BASED MATERIALS FOR HIGH FREQUENCY APPLICATIONS
20220162087 · 2022-05-26 ·

Disclosed are embodiments of high Q modified materials. In some embodiments, complex tungsten oxides and/or hexagonal perovskite crystal structures can be added to provide for advantageous properties. In some embodiments, no tin is used in the formation of the material.

INSULATION SHEET

An object of the present invention is to provide an insulation sheet having high thermal conductivity in the in-plane direction.

The present invention provides an insulation sheet comprising insulating particles and a binder resin, wherein, for the entire cross-section of the sheet perpendicular to the in-plane direction, the insulation sheet contains 75 to 97% by area of the insulating particles, 3 to 25% by area of the binder resin, and 10% by area or less of the voids.

INSULATION SHEET

An object of the present invention is to provide an insulation sheet having high thermal conductivity in the in-plane direction.

The present invention provides an insulation sheet comprising insulating particles and a binder resin, wherein, for the entire cross-section of the sheet perpendicular to the in-plane direction, the insulation sheet contains 75 to 97% by area of the insulating particles, 3 to 25% by area of the binder resin, and 10% by area or less of the voids.

Insulation film composition for grain-oriented electrical steel sheet, method for forming insulation film for grain-oriented electrical steel sheet using same, and grain-oriented electrical steel sheet
11335475 · 2022-05-17 · ·

An insulation film composition for a grain-oriented electrical steel sheet according to an exemplary embodiment of the present invention includes 10-50 parts by weight of metal silicate or organic silicate, 20-70 parts by weight of inorganic nanoparticles and 0.1-20 parts by weight of cobalt hydroxide. The insulation film composition can further include 10-50 parts by weight of metal phosphate, and/or 5-30 parts by weight of inorganic nanoparticles having a particle diameter of 1 nm to less than 10 nm, and/or inorganic nanoparticles having a particle diameter of 10 to 100 nm and/or 0.1-20 parts by weight of chromium oxide.

Insulation film composition for grain-oriented electrical steel sheet, method for forming insulation film for grain-oriented electrical steel sheet using same, and grain-oriented electrical steel sheet
11335475 · 2022-05-17 · ·

An insulation film composition for a grain-oriented electrical steel sheet according to an exemplary embodiment of the present invention includes 10-50 parts by weight of metal silicate or organic silicate, 20-70 parts by weight of inorganic nanoparticles and 0.1-20 parts by weight of cobalt hydroxide. The insulation film composition can further include 10-50 parts by weight of metal phosphate, and/or 5-30 parts by weight of inorganic nanoparticles having a particle diameter of 1 nm to less than 10 nm, and/or inorganic nanoparticles having a particle diameter of 10 to 100 nm and/or 0.1-20 parts by weight of chromium oxide.

Sintered compact, circuit component, and method of producing sintered compact

A sintered compact includes an alumina phase as a primary phase, and further includes an amorphous phase containing Si and Mn and a cordierite phase. The sintered compact has a porosity of higher than or equal to 1.1% and less than or equal to 5.0%. Preferably, I1/(I1+I2) is greater than or equal to 0.20 and less than or equal to 0.45, where I1 is the strength of the main peak of cordierite obtained by an XRD method, and I2 is the strength of the main peak of alumina.