An insulating thermally conductive resin composition (1) includes a phase-separated structure including: a first resin phase (2) in which a first resin continues three-dimensionally; and a second resin phase (3) different from the first resin phase and formed of a second resin. Moreover, the insulating thermally conductive resin composition includes: small-diameter inorganic filler (4) unevenly distributed in the first resin phase; and large-diameter inorganic filler (5) that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler, which is unevenly distributed in the first resin phase, to one another. Then, an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 μm. Moreover, an average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 μm.

A peroxide-crosslinkable composition comprising: (A) A peroxide-crosslinkable polymer, e.g., a polyethylene; (B) A nitrogenous base, e.g., a low molecular weight, or low melting, or liquid nitrogenous base such as triallyl cyanurate (TAC); and (C) One or more antioxidants (AO), e.g., distearylthiodipropionate (DSTDP). The composition is useful in the manufacture of insulation sheaths for high and extra high voltage wire and cable.

The present invention generally relates to deformable polymer composites, and more particularly to, deformable polymer composites with controlled electrical performance during deformation through tailored strain-dependent conductive filler contact. According to embodiments, a deformable elastomeric conductive material includes: an elastomeric polymer matrix; and conductive filler material uniformly dispersed in the elastomeric polymer matrix sufficient to render the material electrically or thermally conductive. The conductive filler material comprises a plurality of substantially non-entangled particles having an aspect ratio sufficiently large to enable the particles to substantially remain in contact and/or in close proximity with adjacent particles so as to maintain conductive pathways in the material when the material is subjected to deformation up to and exceeding 10% strain.

The present invention generally relates to deformable polymer composites, and more particularly to, deformable polymer composites with controlled electrical performance during deformation through tailored strain-dependent conductive filler contact. According to embodiments, a deformable elastomeric conductive material includes: an elastomeric polymer matrix; and conductive filler material uniformly dispersed in the elastomeric polymer matrix sufficient to render the material electrically or thermally conductive. The conductive filler material comprises a plurality of substantially non-entangled particles having an aspect ratio sufficiently large to enable the particles to substantially remain in contact and/or in close proximity with adjacent particles so as to maintain conductive pathways in the material when the material is subjected to deformation up to and exceeding 10% strain.

Provided are a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). The block polyimide comprises blocks configured from repeating structural units represented by defined formula (1A) and blocks configured from repeating structural units represented by defined formula (1B).

Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.

A coating composition includes a fluoroethylene vinyl ether copolymer, a cross-linking agent, and water. The coating composition reduces the operating temperature of an overhead conductor by at least about 5° C. or more compared to a similar uncoated overhead conductor when the operating temperatures of each overhead conductor are measured at about 100° C. or higher and the coating composition is substantially free of solvent. Methods for making a coating composition and for making a coated overhead conductor are disclosed.

A coating composition includes a fluoroethylene vinyl ether copolymer, a cross-linking agent, and water. The coating composition reduces the operating temperature of an overhead conductor by at least about 5° C. or more compared to a similar uncoated overhead conductor when the operating temperatures of each overhead conductor are measured at about 100° C. or higher and the coating composition is substantially free of solvent. Methods for making a coating composition and for making a coated overhead conductor are disclosed.

The present invention is a cable, which carries signal, having an integrated coiling and reinforcing wrapper. The cable has a segment near an end that is stiffer than the cable generally. This segment can be bent by hand, and once bent, will retain its bent shape. If the flexible part of the cable is wrapped into a coil, or otherwise gathered together, then the stiffer portion can be bent around the gathered portion to secure it in its gathered form.

The present invention is a cable, which carries signal, having an integrated coiling and reinforcing wrapper. The cable has a segment near an end that is stiffer than the cable generally. This segment can be bent by hand, and once bent, will retain its bent shape. If the flexible part of the cable is wrapped into a coil, or otherwise gathered together, then the stiffer portion can be bent around the gathered portion to secure it in its gathered form.