Disclosed herein is an implantable cerebral sensor, comprising: an insulator layer; a first electrode disposed on the first insulator: a dielectric layer disposed on the first electrode; and a second electrode disposed on the dielectric layer, the second electrode being electrically separated from the first electrode by the dielectric layer. The first electrode and the second electrode can comprise a conductor, and the insulator layer and the dielectric layer can comprise a polymer. The sensor can be configured to sense a condition in a blood vessel and generate a wireless signal indicative of the sensed condition. Also disclosed herein are systems using the disclosed implantable cerebral sensors and methods of making and using the same.

The present disclosure provides a biological detection device, a biological chip, a microelectrode structure, and a manufacturing method of the microelectrode structure. The microelectrode structure can include a first insulating layer, a protrusion, and an electrode layer. The protrusion is disposed on the first insulating layer. The electrode layer conformally covers the first insulating layer and the protrusion. The present disclosure can improve the detection accuracy.

A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer device of the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.

The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.

The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.

The present invention discloses a flexible cable jumper structure including a cover layer, a first metal layer stacked on the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat resistant layer and electrically connected to the first metal layer and the second metal layer, and a flexible cable jumper device coupled to one side of the flexible cable jumper structure and including an RF connector including a plug having an electrode electrically connected to the terminal layer, and the flexible cable jumper device of the present invention has heat resistance and low loss characteristics by using a heat resistant material and a low dielectric constant material in a hybrid structure.

The present invention discloses a flexible cable jumper structure including a cover layer, a first metal layer stacked on the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat resistant layer and electrically connected to the first metal layer and the second metal layer, and a flexible cable jumper device coupled to one side of the flexible cable jumper structure and including an RF connector including a plug having an electrode electrically connected to the terminal layer, and the flexible cable jumper device of the present invention has heat resistance and low loss characteristics by using a heat resistant material and a low dielectric constant material in a hybrid structure.

An insulated wire, including: a conductor and an insulating film covering the conductor; in which at least one insulating layer constituting the insulating film contains: a thermosetting resin A, and a resin B that is ranked lower than the thermosetting resin A in a tribo-electric series.

An insulated wire, including: a conductor and an insulating film covering the conductor; in which at least one insulating layer constituting the insulating film contains: a thermosetting resin A, and a resin B that is ranked lower than the thermosetting resin A in a tribo-electric series.

The invention pertains to a polymer composition possessing improved resistance towards degradation and discolouring phenomena induced by UV radiation, said composition comprising at least one aromatic sulfone polymer; at least one organic UV absorber and at least one basic compound selected from the group consisting of (i) basic oxides and hydroxides of divalent metals and (ii) salts of a weak acid, and to methods for its manufacture and to shaped articles obtained therefrom.