Disclosed are compositions comprising HCFC-243db, HCFO-1233xf, HCFC-244db and/or HFO-1234yf and at least one additional compound. For the composition comprising 1234yf, the additional compound is selected from the group consisting of HFO-1234ze, HFO-1243zf, HCFC-243db, HCFC-244db, HFC-245cb, HFC-245fa, HCFO-1233xf, HCFO-1233zd, HCFC-253fb, HCFC-234ab, HCFC-243fa, ethylene, HFC-23, CFC-13, HFC-143a, HFC-152a, HFC-236fa, HCO-1130, HCO-1130a, HFO-1336, HCFC-133a, HCFC-254fb, CHF═CHCl, HFO-1141, HCFO-1242zf, HCFO-1223xd, HCFC-233ab, HCFC-226ba, and HFC-227ca. Compositions comprising HCFC-243db, HCFO-1233xf, and/or HCFC-244db are useful in processes to make HFO-1234yf. Compositions comprising HFO-1234yf are useful, among other uses, as heat transfer compositions for use in refrigeration, air-conditioning and heat pump systems.

Disclosed are compositions comprising HCFC-243db, HCFO-1233xf, HCFC-244db and/or HFO-1234yf and at least one additional compound. For the composition comprising 1234yf, the additional compound is selected from the group consisting of HFO-1234ze, HFO-1243zf, HCFC-243db, HCFC-244db, HFC-245cb, HFC-245fa, HCFO-1233xf, HCFO-1233zd, HCFC-253fb, HCFC-234ab, HCFC-243fa, ethylene, HFC-23, CFC-13, HFC-143a, HFC-152a, HFC-236fa, HCO-1130, HCO-1130a, HFO-1336, HCFC-133a, HCFC-254fb, CHF═CHCl, HFO-1141, HCFO-1242zf, HCFO-1223xd, HCFC-233ab, HCFC-226ba, and HFC-227ca. Compositions comprising HCFC-243db, HCFO-1233xf, and/or HCFC-244db are useful in processes to make HFO-1234yf. Compositions comprising HFO-1234yf are useful, among other uses, as heat transfer compositions for use in refrigeration, air-conditioning and heat pump systems.

The present invention provides medium- or high-voltage equipment including a leaktight enclosure in which there are located electrical components and a gas mixture for providing electrical insulation and/or for extinguishing electric arcs that are likely to occur in said enclosure, the gas mixture comprising heptafluoroisobutyronitrile, carbon dioxide, and oxygen in small quantities. Electrical components covered in a solid dielectric layer of varying thickness are located inside said leaktight enclosure of the equipment of the invention.

The present invention provides medium- or high-voltage equipment including a leaktight enclosure in which there are located electrical components and a gas mixture for providing electrical insulation and/or for extinguishing electric arcs that are likely to occur in said enclosure, the gas mixture comprising heptafluoroisobutyronitrile, carbon dioxide, and oxygen in small quantities. Electrical components covered in a solid dielectric layer of varying thickness are located inside said leaktight enclosure of the equipment of the invention.

The present disclosure relates to compositions comprising 2,3,3,3-tetrafluoropropene that may be useful as heat transfer compositions, aerosol propellants, foaming agents, blowing agents, solvents, cleaning agents, carrier fluids, displacement drying agents, buffing abrasion agents, polymerization media, expansion agents for polyolefins and polyurethane, gaseous dielectrics, extinguishing agents, and fire suppression agents in liquid or gaseous form. Additionally, the present disclosure relates to compositions comprising 1,1,2,3-tetrachloropropene, 2-chloro-3,3,3-trifluoropropene, or 2-chloro-1,1,1,2-tetrafluoropropane, which may be useful in processes to produce 2,3,3,3-tetrafluoropropene.

The present disclosure relates to compositions comprising 2,3,3,3-tetrafluoropropene that may be useful as heat transfer compositions, aerosol propellants, foaming agents, blowing agents, solvents, cleaning agents, carrier fluids, displacement drying agents, buffing abrasion agents, polymerization media, expansion agents for polyolefins and polyurethane, gaseous dielectrics, extinguishing agents, and fire suppression agents in liquid or gaseous form. Additionally, the present disclosure relates to compositions comprising 1,1,2,3-tetrachloropropene, 2-chloro-3,3,3-trifluoropropene, or 2-chloro-1,1,1,2-tetrafluoropropane, which may be useful in processes to produce 2,3,3,3-tetrafluoropropene.

A method for increasing the dielectric withstand strength in the enclosure E of an electrical apparatus, this method consisting in placing in the enclosure a dielectric material in liquid or solid form, then in bringing this material to a temperature and/or a pressure allowing for its total or partial evaporation in the enclosure. This method includes a device for retaining the abovementioned material in its container during the handling allowing the placement of the container in the enclosure E, and a device for inducing the evaporation of this material at a certain moment after this placement in the enclosure E and for allowing the dispersion of the gases resulting from this evaporation in the enclosure E.

The present invention relates to an electrical apparatus having an insulating space which contains a dielectric insulation fluid comprising an organofluorine compound. At least one solid component of the apparatus that is directly exposed to the insulation fluid contains a basic body made of a first material and a protective layer made of a second material different from the first material, the protective layer being directly or indirectly applied on the basic body and having a thickness of at least 50 μm. The organofluorine compound is selected from the group consisting of: fluoroethers, fluoroketones, fluoroolefins, fluoronitriles, and mixtures thereof, and the first material comprises or consists of a material selected from the group consisting of: a polymeric material, a ceramic, a composite material, and mixtures or combinations thereof.

The present invention relates to an electrical apparatus having an insulating space which contains a dielectric insulation fluid comprising an organofluorine compound. At least one solid component of the apparatus that is directly exposed to the insulation fluid contains a basic body made of a first material and a protective layer made of a second material different from the first material, the protective layer being directly or indirectly applied on the basic body and having a thickness of at least 50 μm. The organofluorine compound is selected from the group consisting of: fluoroethers, fluoroketones, fluoroolefins, fluoronitriles, and mixtures thereof, and the first material comprises or consists of a material selected from the group consisting of: a polymeric material, a ceramic, a composite material, and mixtures or combinations thereof.

A hydrofluoroether compound is represented by the following general formula (1): wherein n is 1-2.

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