A fluid circulation device having at least one fluid circulation tube, a first coupling sealingly coupled to a first end of the tube and a second coupling sealingly coupled to a second end of the tube in such a way as to allow the circulation of fluid between said two couplings via the tube. The device further has separate electronic elements. The tube has at least one conductor track extending along an outer surface of the tube. The track is suitable for transmitting at least one signal and arranged to engage with the abovementioned electronic elements.

A conductive path with noise filter that enables an effective reduction in a surge noise in a specific frequency band is provided. A conductive path with noise filter includes conductive path main, an insulating holder, inductors provided in the holder, receiving terminal fittings provided in the holder, insertion-side terminal fittings capable of being fitted to the receiving terminal fittings, a U-phase capacitor provided between the U-phase wire and the U-phase insertion-side terminal fitting, a V-phase capacitor provided between the V-phase wire and the V-phase insertion-side terminal fitting, and a W-phase capacitor provided between the W-phase wire and the W-phase insertion-side terminal fitting.

High annealing temperature tree wire may be provided. The high annealing temperature tree wire may compromise a conductor core, a plurality of conductor strands, and at least one covering layer. The conductor core may comprise a first material. The plurality of conductor strands may be wrapped around the conductor core. The plurality of conductor strands may comprise a second material. The second material may anneal at a temperature above an operating temperature range of the electrical conductor. The at least one covering layer may be disposed around the plurality of conductor strands.

The invention relates to a conductor assembly (1), in particular for use in electric vehicles or hybrid vehicles, comprising at least one planar first current-conducting component (10) having a first outer face (12) and a first inner face (13) facing away from the first outer face (12), and comprising at least one planar second current-conducting component (20) having a second outer face (22) and a second inner face (23) facing away from the second outer face (22), wherein the second current-conducting component (20) is arranged in such a way that the second inner face (23) of the second current-conducting component (20) is opposite the first inner face (13) of the first current-conducting component (10). According to the invention, a first coating (18) is applied to the first inner face (13) of the current-conducting component (10), wherein the material of the first coating (18) has a lower electrical conductivity than the material of the first current-conducting component (10) and/or that a second coating (28) is applied to the second inner face (23) of the second current-conducting component (20), wherein the material of the second coating (28) has a lower electrical conductivity than the material of the second current-conducting component (20).

An object of the present invention is to provide a lead wire having a conductor that is hardly pulled out from the lead wire during the peeling process or the like while being formed of carbon fibers. In the present invention, a belt-shaped conductor formed of a plurality of carbon fibers are included in a lead wire having a circular cross section.

An electrically insulated electrical conductive strip (1), especially for electric motors and transformers, having an electrical conductor (2) in strip form that has an upper face (2a) and a lower face (2b), two lateral edge faces (2c) and one end edge face at each end, and having an electrical insulation (3) disposed on at least one face of the strip (2a, 2b). The insulation (3) has an enamel layer (3a) and an adhesive strip (3b) bonded to the lower face (2b) and/or the upper face (2a) of the electrical conductor (2) in strip form, in each case at least in a region (4) that directly adjoins a lateral edge face (2c).

Methods and apparatus are disclosed. The apparatus includes a substantially cylindrical mount body (350) comprising a first open mouth at a first end of the cylindrical body (350) and a further open mouth at a remaining end of the cylindrical body, a substantially cylindrical inner surface, and an outer surface that includes a plurality of spaced apart substantially parallel recessed regions that extends circumferentially around the body, wherein the cylindrical body (350) is tapered at each end and at least one securing element is located between the recessed regions.

flexible pipe body and a method of providing electrical continuity are disclosed. The flexible pipe body comprises a first armour layer formed from a helical winding of a metal tape element, a further armour layer formed from a helical winding of a further metal tape element, and at least one intermediate layer between the first and further armour layers, said intermediate layer comprising a helically wound electrically insulating tape element (800.sub.0, 800.sub.1, 800.sub.2, 800.sub.3, 800.sub.4) and a helically wound electrically conductive tape element (810.sub.0, 810.sub.1, 810.sub.2, 810.sub.3, 810.sub.4).

A composite conductive structure includes plural enameled wires and a copper foil. The enameled wires are immediately adjacent to each other and extend in the same direction. The copper foil surrounds the outside of the enameled wires at least once, and completely covers the entire outside of the enameled wires.

Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.