Patent classifications
H01B7/048
Flexible Implantable Electrode Arrangement and Production Method
A flexible implantable electrode arrangement includes an electrically insulating carrier structure of a first polymer material, an electrically conductive layer, and an electrically insulating cover layer of a second polymer material. The electrically conductive layer includes an electrically conductive carbon fiber layer. The electrically conductive layer integrally forms an implantable electrode, a conductor track connected to the implantable electrode, and a contact pad. The electrically insulating cover layer at least partially covers the electrically conductive layer.
MULTI-LAYER STRUCTURE, SYSTEM, USE AND METHOD
The invention relates to a multi-layer structure having at least one flexible backing layer, at least one electrically insulating layer, and at least one electrically conductive layer, the electrically insulating layer being arranged between and connected to the backing layer and the electrically conductive layer, at least the backing layer being able to be elongated by at least 0.5% and comprising a shape memory material that is adapted to transmit restoring forces to mend cracks in the electrically insulating layer.
FRACTURE RESISTANT STIMULATION LEAD
A lead may comprise a multiple filar wire comprising an inner core, an inner layer and an outer layer, where a portion of the inner layer is wound in a first orientation and the inner layer comprises a first number of filars of wire and where a portion of the outer layer is wound in a second orientation opposite the first orientation and the outer layer comprises a second number of filars of wire, the second number of filars of wire being greater than the first number of filars of wire. The lead may also comprise insulation covering a portion of the multiple filar wire, the portion of the multiple filar wire and the insulation comprising a helical coil structure wound in the first orientation and an anchor formed by the inner core, inner layer and outer layer extending away from the portion of the multiple filar wire, wherein the anchor comprises no helical coil structure.
Devices and systems for obtaining conductance data and methods of manufacturing and using the same
Devices and systems for obtaining conductance data and methods of manufacturing and using the same. In at least one embodiment of a device of the present disclosure, the device is an elongated body with at least one groove defined therein, the at least one groove configured to receive one or more conductor wires therein. In another embodiment, the device is an elongated core body having a plurality of conductive elements positioned thereon and a coating to result in a device having an overall round-cross section.
Patient adapter for driveline cable and methods
A patient adapter for connecting a driveline cable between an implantable blood pump and a controller. The patient adapter provides a sufficiently large form factor to make connecting ends of a driveline cable easy for patients who lack dexterity or have unclear vision. The patient adapter includes an adapter body that defines a central lumen that extends through an entire length of the adapter body. The central lumen is configured to receive an end of a percutaneous end connector of the driveline cable and an end of a controller end connector of the driveline cable. The patient adapter includes a first mating feature configured to engage a corresponding feature of the percutaneous end connector and a second mating feature configured to engage a corresponding feature of the controller end connector. A thickness of the adapter body is greatest at a position proximate the controller end connector.
High density electrode structure
Electrode cabling, including a core and n wires coiled on the core in an arrangement topologically equivalent to an n-start thread configuration, wherein n is an integer greater than one. The cabling also includes a sheath covering the n wires and an electrode attached through the sheath to a given wire selected from the n wires.
Surgical Insufflation and Irrigation Conduits and Methods for Use
The presently disclosed embodiments relate to insufflation and irrigation conduits for vessel harvesting systems and methods of their use. In particular, the present disclosure relates to a system having a combined cabling for providing gases, liquids, and/or electrical power to an attached medical device and method of use.
PERCUTANEOUS LEAD
A percutaneous lead assembly for an active implantable device, the lead assembly comprising a sheath with a plurality of wires extending from a proximal end to a distal end. The wires being adapted to power the active implantable device; the distal end having at least one electrode fixed thereon. The electrodes being in communication with sensor electronics and wherein at least one electrode is on the outer layer of the lead assembly in which the electrode is used to detect at least one of acceleration and electrical signals of an organ.
Connection of electrodes to wires coiled on a core
A method for attaching an electrode to cabling, including providing a cable having a plurality of insulated wires coiled around a central core. The method further includes removing insulation from each wire in a set of the coiled wires so as to provide a respective access channel to a respective section of a respective conductor of each wire in the set while the respective section remains coiled on the central core. The method further includes fastening a respective electrode to the respective access channel while the respective section remains coiled on the central core.
DIFFUSION BARRIER FOR IMPLANTABLE ELECTRODE LEADS
A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.