A wiring assembly including a flex circuit including a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate. The wiring assembly further includes a flex circuit attachment feature, the flex circuit attachment feature including an extruded material bonded to the plastic laminate layer at the mount location. The flex circuit attachment feature provides a structural strength at the mount location and provides a cushion between the flex circuit and the substrate.

A layout method applied to a connector is provided. The connector is electrically connected between a flexible printed circuit (FPC) and a printed circuit board (PCB). The FPC includes M pairs of differential lines and X shield lines. The PCB includes M pairs of differential lines and Z shield lines. The layout method includes following steps. Firstly, M pairs of conductive lines are disposed on the connector. The M conductive lines are correspondingly electrically connected to the M differential lines of the FPC and the M differential lines of the PCB. Then; Y conductive lines are disposed on the connector, wherein Y is smaller than X. Furthermore, at least one of the Y conductive lines is electrically connected to at least one of the X shield lines and at least one of the Z shield lines.

A wire harness includes a plurality of outer cover materials covering a plurality of outer coverage zones spaced in a lengthwise direction of a main line portion of a wire bundle, the plurality of outer cover materials being formed into a plate shape from their respective nonwoven material and being a plurality of plate-shaped bodies having a plate width in the lengthwise direction of the main line portion and a plate length greater than the plate width in a radial direction of the main line portion.

A cable includes a first metal conductor, a first insulator, a second metal conductor and a second insulator. The first insulator is at least partially wrapped on the first metal conductor. The second insulator is at least partially wrapped on the second metal conductor. The first metal conductor is adapted to transmit a first signal. The second metal conductor is adapted to transmit a second signal. The cable also includes an intermediate layer material at least partially wound on the first insulator and the second insulator. A dielectric constant of the intermediate layer material is lower than that of the first insulator, and the dielectric constant of the intermediate layer material is lower than that of the second insulator. With this arrangement, the cable of the present disclosure is capable of realizing low mode conversion and improving the high frequency characteristics.

Disclosed is a flat cable with an improved function of preventing a short phenomenon that may occur when the flat cable is incorrectly inserted into a connector. The flat cable according to an embodiment of the present disclosure is a flat cable extending straight in a direction and having a front end that is inserted and connected to an external connector, and includes a plurality of conductors extending straight along a lengthwise direction of the flat cable, spaced apart a predetermined distance in a widthwise direction of the flat cable, and a cable body made of an insulating material, and extending straight along the lengthwise direction of the flat cable, wherein the conductors are mounted on at least one surface.

A shielded electrical cable includes conductor sets extending along a length of the cable and spaced apart from each other along a width of the cable. First and second shielding films are disposed on opposite sides of the cable and include cover portions and pinched portions arranged such that, in transverse cross section, the cover portions of the films in combination substantially surround each conductor set. An adhesive layer bonds the shielding films together in the pinched portions of the cable. A transverse bending of the cable at a cable location of no more than 180 degrees over an inner radius of at most 2 mm causes a cable impedance of the selected insulated conductor proximate the cable location to vary by no more than 2 percent from an initial cable impedance measured at the cable location in an unbent configuration.

Flexible cables may include multiple power, ground, and signal traces, and include EM interference suppression devices within the cable itself. Signal traces may be shielded by ground traces. The body of a cable may be divided into lateral portions through which different types of traces extend. One lateral side of a cable body may include a stack of power traces, while another lateral side of the cable body may include ground and signal traces. EBG patterns may be incorporated into ground traces. Capacitors may be positioned within the cable along its length, mounted between power and ground traces, for decoupling.

A cable (100) includes a power wire (1), a ground wire (3), data transmission wires (2) between the power wire and the ground wire, and an insulating outer layer (4) enclosing the outer side of the power wire, the ground wire, and the data transmission wires. The power wire includes a conductor (11), an insulating layer (12) outside the conductor, and a metal shielding layer (13) outside the insulating layer. The power wire and the data transmission wires are spaced from each other by plastic materials.

A wiring member includes: a flat wiring member including a sheet member, and a plurality of wire-like transmission members fixed on the sheet member in a parallel state; and a protective member configured to accommodate the flat wiring member. The protective member includes a placement surface on which the sheet member is placed. The sheet member includes a disposition region in which the plurality of wire-like transmission members are disposed. The sheet member is placed on the placement surface so that at least the disposition region extends along the placement surface.

The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.