A wiring member includes a sheet material including a first layer formed into a sheet-like shape and a second layer provided on a main surface of the first layer, and a wire-like transmission member fixed on the sheet material. The second layer is a layer mediating a bonding of the first layer and the wire-like transmission member, and includes a plurality of partial second layers provided to be separated from each other along an extension direction of the wire-like transmission member.

The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly further includes an interface formed on the supporting structure at the distal end of the cable. The interface includes electrodes and/or sensors in electrical connection with the conductive traces, and the supporting structure has at least one curved portion disposed between a first set of electrodes and a second set of electrodes, and/or between a first set of sensors and a second set of sensors.