A flat conductor includes an elongated conductive plate material having an end portion in a longitudinal direction and a central portion adjacent to the end portion. A conductor resistance per unit length of at least one end portion in the plate material is lower than a conductor resistance per unit length of the central portion. The flat conductor includes a thermally conductive sheet that connects the end portion and the central portion of the plate material and is made of a material having a higher thermal conductivity than the end portion and the central portion.

Systems, methods, and communication cables taught herein provide cryogenic cooling, high voltage connections, and other electrical connections to a sample on a stage within a vacuum environment while still enabling stage motion in at least five degrees of freedom with minimal stage vibration to enable new or improved measurement applications in-situ within the microscope such as atom probe tomography and testing of quantum computing components. The connection cables taught herein combine connections into a single connection cable within an outer spring that is suitable for use in ultra-high vacuum. The connection cables are also shaped and configured to maintain at least a minimum standoff distance from components in the nearby environment (e.g., chamber walls and other equipment) to prevent mechanical, electrical, and thermal shortcutting.

The present disclosure discloses a conductive wire, a conductive coil, and a conductive device, wherein in the conductive wire, a metal oxide-coated carbon material is added to a first paint layer, and a silver-coated carbon material is added to a second paint layer. By means of such an arrangement, the coefficient of thermal conductivity of the first paint layer and the second paint layer reaches 2 to 10 W/(m.Math.K), and therefore, the thermal conduction performance of the conductive wire can be remarkably improved, and the thermal conduction wire has an advantage of a good thermal conduction effect, with timely heat dissipation.