Patent classifications
H01B9/024
ELECTRICAL AND THERMAL CONNECTION CABLE FOR CHARGED PARTICLE MICROSCOPES
Systems, methods, and communication cables taught herein provide cryogenic cooling, high voltage connections, and other electrical connections to a sample on a stage within a vacuum environment while still enabling stage motion in at least five degrees of freedom with minimal stage vibration to enable new or improved measurement applications in-situ within the microscope such as atom probe tomography and testing of quantum computing components. The connection cables taught herein combine connections into a single connection cable within an outer spring that is suitable for use in ultra-high vacuum. The connection cables are also shaped and configured to maintain at least a minimum standoff distance from components in the nearby environment (e.g., chamber walls and other equipment) to prevent mechanical, electrical, and thermal shortcutting.
MC cable with tearable assembly tape
Disclosed is an armored cable assembly including a core having a notched assembly tape about a plurality of conductors. A metal sheath surrounds the core.
QUICK POWER CONNECTION STRUCTURE
Provided is a quick power connection structure, which relates to the technical field of power connection, and comprises a cable and a quick connection member connected to the cable, wherein the cable comprises an insulator and a conductor, the quick connection member comprises conductive pins and an extrusion member, and the extrusion member is provided with a limiting structure, so that the conductive pins are unable to be continuously pierced into the cable by the extrusion member, and power connection positions at end portions of a plurality of conductive pins pierced into the cable are connected with corresponding conductor layers respectively; and an outer surface of a body portion of the conductive pin penetrating through the conductor layer is an insulator, so that the power connection position at the end portion of the conductive pin is in contact power connection with a target conductor layer.