A wire or cable comprising an insulation layer and a semiconducting shield layer over and in contact with the insulation layer and strippable from the insulation layer, the second semiconducting shield layer made from the composition comprising: (A) 45-52% ethylene vinyl acetate (EVA) comprising 28-45% units derived from vinyl acetate (VA) based on the weight of the EVA; (B) 30-45% carbon black having (1) 80-1 15 milliliters per 100 grams (ml/100 g) DBP absorption value, (2) 30-60 milligrams per gram (mg/g) iodine absorption (I2NO), and (3) 0.3-0.6 grams/milliliter (g/ml) apparent density; (C) 5-20% acrylonitrile butadiene rubber (NBR) comprising 25-55% units derived from acrylonitrile (AN) based on the weight of the NBR; (D) 0.2-2% phenolic antioxidant; and (E) 0.5-2% organic peroxide.

The invention relates to a semiconductive polymer composition comprising a polymer component, a conducting component and a crosslinking agent, wherein the polymer component comprises a polar polyethylene and the crosslinking agent comprises an aliphatic mono- or bifunctional peroxide or, alternatively, a monofunctional peroxide containing an aromatic group, and the crosslinking agent is present in an amount which is Z wt %, based on the total amount (100 wt %) of the polymer composition, and Z.sub.1?Z?Z.sub.2, wherein Z.sub.1 is 0.01 and Z.sub.2 is 5.0, an article being e.g. a cable, e.g. a power cable, and processes for producing a semiconductive polymer composition and an article; useful in different end applications, such as wire and cable (W&C) applications.

A method of building an insulation system around a naked conductor section of a power cable. The insulation system includes an inner semiconducting layer arranged around the conductor, an insulation layer arranged around the inner semiconducting layer, and an outer semiconducting layer arranged around the insulation layer. The method includes: a) placing the naked conductor section in a mold, and b) molding an insulation system around the naked conductor section, wherein the molding of the insulation system involves injecting a first semiconducting compound into a first mold cavity to form an inner semiconducting layer around the naked conductor section, injecting an insulation compound into a second mold cavity to form an insulation layer around the inner semiconducting layer, and injecting a second semiconducting compound into a third mold cavity to form an outer semiconducting layer around the insulation layer.

A cable comprising one or more conductors surrounded by at least an inner semiconductive layer, an insulation layer and an outer semiconductive layer, in that order, wherein said insulation layer comprises an LDPE homopolymer or copolymer having a density of 927 to 940 kg/m.sup.3 and wherein the conductivity of the LDPE is 5.0 fS/m or less when measured according to DC conductivity method as described under Determination Methods.

The present invention relates to a submarine cable having a bimetallic armor. In particular, the present invention relates to a submarine cable capable of effectively suppressing damage to and corrosion of an armor formed of different types of metals due to a local decrease in tensile strength thereof and capable of avoiding an increase in an external diameter of the cable, the structural instability of the cable, and damage to the cable during the manufacture and installation thereof.

Semiconductive tapes for use with electric cables, such as high voltage power cables, and methods for manufacturing such tapes, are provided. A semiconductive tape comprises a first layer comprising a fabric and a second layer in contact with the first layer. The second layer comprises an activated carbon or carbon black. The semiconductive tapes have increased friction while still maintaining sufficient electrical conductivity for use as wrappings for electric power cables, thereby improving the manufacturing process and reducing the overall cost of production.

There is provided an HVDC cable accessory comprising an electric stress control layer which at one position is adapted to be connected to an HVDC cable, wherein the HVDC cable accessory is prefabricated, and the electric stress control layer comprises a thermoplastic elastomer.

In examples of the disclosure, a device may be couple an electrical load to a power source. The device may have a first coupling configured to couple to the power source and a second coupling configured to couple to the electrical load. The device may have a plurality of strands electrically disposed between the first coupling and the second coupling. Each of the plurality of strands may have a coating having a resistivity greater than 1.8?10.sup.?8 ?-m and less than 1 ?-m and a center conductor wrapped, at least in part, by the coating.

A cable comprising one or more conductors surrounded by at least an inner semiconductive layer, an insulation layer and an outer semiconductive layer, in that order, wherein said insulation layer comprises at least 90 wt % of a polymer composition, said polymer composition comprising (I) 80.0 to 99.9 wt % of an LDPE homopolymer or copolymer; and (II) 0.1 to 20.0 wt % of: (i) an ultra-high molecular weight polyethylene having a Mw of at least 1,000,000; or (ii) a single site catalysed medium density polyethylene (MDPE) having a density of 925 to 940 kg/m.sup.3 or a single site catalysed linear low density polyethylene (LLDPE) having a density of 910 to 925 kg/m.sup.3.

Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to 15 parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.