A light detection device having improved self-alignment precision using a hard mask, and a method for manufacturing the same is provided. A method of manufacturing a light detection device includes i) providing a substrate; ii) providing a light reflecting portion on the substrate; iii) providing a light detection portion on the light reflection portion; iv) providing an anti-reflection portion provided on the light reflection portion to cover the light detection portion; v) removing each of the first outer periphery of the light reflection portion and the second outer periphery of the anti-reflection portion, and vi) providing a hard mask formed to correspond to the removed first outer periphery, positioned on the substrate, and spaced apart from the light reflecting portion to surround the light reflecting portion.

The present disclosure relates to routing superconducting wires in superconducting circuits and in particular to efficiently routing superconducting wires that meet inductance requirements. The superconducting wire routing technique involves modeling the target location not only as a physical location, but as a physical location (e.g., x, y, and z dimensions) combined with inductance (e.g., a target inductance range). One or more other constraints may also be included in the modeling, such as a number of wires that would need to be moved/lifted, a number of circuit-vias allowing passage through layers of the circuit, an amount of cross-coupling with other inductors, and a number of wire segments.

The present disclosure relates to routing superconducting wires in superconducting circuits and in particular to efficiently routing superconducting wires that meet inductance requirements. The superconducting wire routing technique involves modeling the target location not only as a physical location, but as a physical location (e.g., x, y, and z dimensions) combined with inductance (e.g., a target inductance range). One or more other constraints may also be included in the modeling, such as a number of wires that would need to be moved/lifted, a number of circuit-vias allowing passage through layers of the circuit, an amount of cross-coupling with other inductors, and a number of wire segments.

Methods, apparatuses, and devices for quantum chip preparation include acquiring a coplanar waveguide in a quantum chip; and establishing a connecting bridge on the coplanar waveguide using a bonding machine, wherein the connecting bridge is configured to connect a first reference ground and a second reference ground located on two sides of the coplanar waveguide to change the chip electromagnetic resonance frequency. A quantum chip includes a transmission line configured for signal transmission; and a resonant cavity coupled to the transmission line and configured to regulate an operating state of qubits on the quantum chip, wherein the transmission line and the resonant cavity are both composed of a coplanar waveguide, the coplanar waveguide is provided with a connecting bridge, and the connecting bridge is configured to connect a first reference ground and a second reference ground on two sides of the coplanar waveguide to change the chip electromagnetic resonance frequency.

Methods, apparatuses, and devices for quantum chip preparation include acquiring a coplanar waveguide in a quantum chip; and establishing a connecting bridge on the coplanar waveguide using a bonding machine, wherein the connecting bridge is configured to connect a first reference ground and a second reference ground located on two sides of the coplanar waveguide to change the chip electromagnetic resonance frequency. A quantum chip includes a transmission line configured for signal transmission; and a resonant cavity coupled to the transmission line and configured to regulate an operating state of qubits on the quantum chip, wherein the transmission line and the resonant cavity are both composed of a coplanar waveguide, the coplanar waveguide is provided with a connecting bridge, and the connecting bridge is configured to connect a first reference ground and a second reference ground on two sides of the coplanar waveguide to change the chip electromagnetic resonance frequency.

The present invention addresses a problem of providing an MgB2 wire material having a small reversible bending radius, a superconducting coil using the same, and an MRI without lowering a critical current value and a critical current density of the MgB2 wire material to an extreme. To solve the problem, provided are a superconducting wire having a plurality of MgB2 strands and a first base metal, a superconducting coil using the same, and an MRI, the superconducting wire being characterized in that in a cross section orthogonal to a wire longitudinal direction, a center point of an area surrounded by the plurality of MgB2 strands and a center axis of a cross section of the superconducting wire are disposed in separated positions.

The present invention addresses a problem of providing an MgB2 wire material having a small reversible bending radius, a superconducting coil using the same, and an MRI without lowering a critical current value and a critical current density of the MgB2 wire material to an extreme. To solve the problem, provided are a superconducting wire having a plurality of MgB2 strands and a first base metal, a superconducting coil using the same, and an MRI, the superconducting wire being characterized in that in a cross section orthogonal to a wire longitudinal direction, a center point of an area surrounded by the plurality of MgB2 strands and a center axis of a cross section of the superconducting wire are disposed in separated positions.

In the connection portion for a superconducting wire, a plurality of superconducting wires are integrated by a sintered body containing MgB.sub.2, end portions of the superconducting wires each having an outer peripheral surface of a superconducting filament exposed are inserted into a container in parallel. The container has an opening having a diameter larger than a wire diameter of the superconducting wires on at least one side in a longitudinal direction of the superconducting wires, and the sintered body is in contact with the outer peripheral surfaces of the superconducting filaments. The method for connecting a superconducting wire includes: exposing the outer peripheral surfaces of the superconducting filaments; inserting the superconducting wires into the container; filling the container with a raw material; and heat-treating the raw material to generate the sintered body. The raw material is pressurized in parallel to the longitudinal direction of the superconducting wires and then heat-treated.

A Josephson junction (JJ) device is provided. The JJ device comprises an operating JJ, a first hydrogen-trapping JJ having a first end coupled to a first end of the operating JJ and a second end coupled to a first superconductor wire, and a second hydrogen-trapping JJ having a first end coupled to a second end of the operating JJ and a second end coupled to a second superconductor wire. The first hydrogen-trapping JJ and the second hydrogen-trapping JJ mitigates hydrogen diffusion into the operating JJ.

The invention relates to power systems. More particularly, the invention relates to electric vehicle battery charging systems. In the invention a superconducting conductor is used to charge the electric car battery, resulting in a short charging time.