An assembly can include a housing that includes opposing ends, a longitudinal axis, an axial length defined between the opposing ends, a maximum transverse dimension that is less than the length and an interior space; circuitry disposed at least in part in the interior space; and a coated electrical conductor electrically coupled to the circuitry where the coated electrical conductor includes an electrical conductor that includes copper and a length defined by opposing ends, a polymeric electrical insulation layer disposed about at least a portion of the length of the electrical conductor, and a barrier layer disposed about at least a portion of the polymeric electrical insulation layer.

A covered electric wire comprises an insulating coating layer on the outer side of a conductor. The conductor comprises a copper alloy consisting of: not less than 0.05% by mass and not more than 2.0% by mass of Fe; not less than 0.02% by mass and not more than 1.0% by mass of Ti; not less than 0% by mass and not more than 0.6% by mass of Mg; and the balance being Cu and impurities. The covered electric wire is a stranded wire comprising a plurality of copper alloy wires stranded together. The plurality of copper alloy wires each have a work hardening coefficient of not less than 0.1 and a wire diameter of not more than 0.5 mm.

A covered electric wire comprises an insulating coating layer on the outer side of a conductor. The conductor comprises a copper alloy consisting of: not less than 0.05% by mass and not more than 2.0% by mass of Fe; not less than 0.02% by mass and not more than 1.0% by mass of Ti; not less than 0% by mass and not more than 0.6% by mass of Mg; and the balance being Cu and impurities. The covered electric wire is a stranded wire comprising a plurality of copper alloy wires stranded together. The plurality of copper alloy wires each have a work hardening coefficient of not less than 0.1 and a wire diameter of not more than 0.5 mm.

A miniature photoelectric composite cable for high-definition video signal transmission includes a flat optical fiber component and a round electrical component. The flat optical fiber component includes a multi-core optical fiber, a strengthening layer, and a light jacket. The round electrical component includes a multi-core electrical cable, a cladding, and an electric jacket. The cladding covers outside the multi-core electrical cable. The optical fiber component and the electrical component are arranged side-by-side.

A miniature photoelectric composite cable for high-definition video signal transmission includes a flat optical fiber component and a round electrical component. The flat optical fiber component includes a multi-core optical fiber, a strengthening layer, and a light jacket. The round electrical component includes a multi-core electrical cable, a cladding, and an electric jacket. The cladding covers outside the multi-core electrical cable. The optical fiber component and the electrical component are arranged side-by-side.

A power cable can include a conductor; an insulation layer disposed about the conductor where the insulation layer includes a first polymeric material; and a shield layer disposed about the insulation layer where the shield layer includes a second polymeric material where a solubility parameter of the first polymeric material is less than a solubility parameter of the second polymeric material.

A power cable can include a conductor; an insulation layer disposed about the conductor where the insulation layer includes a first polymeric material; and a shield layer disposed about the insulation layer where the shield layer includes a second polymeric material where a solubility parameter of the first polymeric material is less than a solubility parameter of the second polymeric material.

Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.

Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.

Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an external semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a power cable includes: 20 to 70 parts by weight of any one or two or more conductive particles selected from the group consisting of carbon black, graphite and graphene, based on 100 parts by weight of a composite resin including a polypropylene homopolymer having a melting point of 150 to 170 C. and an ethylene-(meth)acrylate-based resin.