An electrically traced tubing bundle includes one or more tubes and an electric heating element, encased in insulation and covered by a jacket. The heating element is given a discontinuity at a point intermediate the ends of the tubing bundle. A power extension supply wire extends from a powered end of the bundle to the discontinuity and is connected to the remote portion of the heating element. At the discontinuity, the end of the near portion of the heating element is terminated. The end of the remote portion of the heating element is terminated at the remote end of the tubing bundle.

The application of a titanium hydride coating on a ceramic, preferably an alumina ceramic, as a facile and inexpensive approach to bond gold to the ceramic during brazing is described. During the brazing process, the deposited titanium hydride is first partially decomposed to form pure titanium intermixed with titanium hydride. The combination of pure titanium and titanium hydride contributes to improved adhesion of gold with the alumina ceramic without any detrimental reaction between pure titanium and gold. The titanium hydride coating can be applied by dip/spray/paint coating.

A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.

A liquid-tight strain relief includes a tubular-shaped bushing and a dome-shaped gland. The bushing includes a flange with arcuate slots, a centrally-located aperture, a plurality of resilient outer fingers, and a shoe slideably received within a lateral groove of the bushing. The gland includes a head having a centrally-located membrane. The head is co-molded with and encapsulates the flange, resulting in a strain relief having a unitary construction. The strain relief is adapted to be inserted within an orifice of a work piece, and the outer fingers frictionally engage the work piece. A cable is inserted within the strain relief by puncturing the membrane, which then stretches and provides a seal against the cable. The cable is gripped to the strain relief when the shoe is pressed against the cable. The shoe is held against the cable by teeth on the shoe, which engage opposing locking ribs on the bushing.

A liquid-tight strain relief includes a tubular-shaped bushing and a dome-shaped gland. The bushing includes a flange with arcuate slots, a centrally-located aperture, a plurality of resilient outer fingers, and a shoe slideably received within a lateral groove of the bushing. The gland includes a head having a centrally-located membrane. The head is co-molded with and encapsulates the flange, resulting in a strain relief having a unitary construction. The strain relief is adapted to be inserted within an orifice of a work piece, and the outer fingers frictionally engage the work piece. A cable is inserted within the strain relief by puncturing the membrane, which then stretches and provides a seal against the cable. The cable is gripped to the strain relief when the shoe is pressed against the cable. The shoe is held against the cable by teeth on the shoe, which engage opposing locking ribs on the bushing.

Feedthrough device (50; 150), for forming a hermetic seal around signal conductors in a signal conductor group (60; 160) with a group width. The device comprises a slotted member (52; 152) and a base (62; 162). The base defines a through hole (65) that extends entirely through the base along a feedthrough direction (X), and is adapted to accommodate the slotted member. The slotted member defines first and second surfaces (53, 54; 153, 154) on opposite sides associated with the feedthrough direction, and a side surface (55, 56; 155, 156) facing transverse to the feedthrough direction. The slotted member comprises a slot (58; 158), which extends along the feedthrough direction through the slotted member, and opens into the first and second surfaces and into a longitudinal opening (59; 159) along the side surface. The slot extends transversely into the slotted member up to a slot depth at least equal to the signal conductor group width.

Feedthrough device (50; 150), for forming a hermetic seal around signal conductors in a signal conductor group (60; 160) with a group width. The device comprises a slotted member (52; 152) and a base (62; 162). The base defines a through hole (65) that extends entirely through the base along a feedthrough direction (X), and is adapted to accommodate the slotted member. The slotted member defines first and second surfaces (53, 54; 153, 154) on opposite sides associated with the feedthrough direction, and a side surface (55, 56; 155, 156) facing transverse to the feedthrough direction. The slotted member comprises a slot (58; 158), which extends along the feedthrough direction through the slotted member, and opens into the first and second surfaces and into a longitudinal opening (59; 159) along the side surface. The slot extends transversely into the slotted member up to a slot depth at least equal to the signal conductor group width.

A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.

A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.

A glass-metal feedthrough consists of an external conductor, a glass material and an internal conductor. The internal conductor has a coefficient of expansion .sub.internal, the glass material has a coefficient of expansion .sub.glass, and the external conductor has a coefficient of expansion .sub.external. The coefficient of expansion of the internal conductor .sub.internal is greater than the coefficient of expansion of the glass material .sub.glass and the coefficient of expansion of the external conductor .sub.external is at least 2 ppm/K, such as at least 4 ppm/K, greater than the coefficient of expansion of the glass material .sub.glass in the temperature range of 20 C. to the glass transformation temperature.