A conductor arrangement for an electrical connection includes a flexible multi-core internal conductor, an electromagnetic shield surrounding the flexible multi-core internal conductor, a thermoplastic hard plastic sheath surrounding a first portion of the flexible multi-core internal conductor, and a flexible corrugated tube surrounding a second portion the flexible multi-core internal conductor. A first portion of the thermoplastic hard plastic sheath includes an elongated flattened shape. A second portion of the thermoplastic hard plastic sheath includes an essentially round shape. The second portion of the thermoplastic hard plastic sheath is adjacent the first portion of the thermoplastic hard plastic sheath.

Provided are a novel insulating material for a circuit substrate and a novel metal foil-clad laminate, and the like, in which the anisotropy of coefficients of linear thermal expansion in a MD direction, a TD direction, and a ZD direction is reduced. An insulating material for a circuit substrate, comprising a thermoplastic liquid crystal polymer film, wherein ratios of average coefficients of linear thermal expansion in a MD direction, a TD direction, and a thickness direction (CTE.sub.MD, CTE.sub.TD, CTE.sub.Z) at 23 to 200° C., as measured by a TMA method according to JIS K7197, satisfy the following expressions (I) to (III):

0.5≤CTE.sub.MD/CTE.sub.TD≤1.5   (I)

0.10≤CTE.sub.MD/CTE.sub.Z≤1.00   (II)

0.10≤CTE.sub.TD/CTE.sub.Z≤1.00   (III).

Provided are a novel insulating material for a circuit substrate and a novel metal foil-clad laminate, and the like, in which the anisotropy of coefficients of linear thermal expansion in a MD direction, a TD direction, and a ZD direction is reduced. An insulating material for a circuit substrate, comprising a thermoplastic liquid crystal polymer film, wherein ratios of average coefficients of linear thermal expansion in a MD direction, a TD direction, and a thickness direction (CTE.sub.MD, CTE.sub.TD, CTE.sub.Z) at 23 to 200° C., as measured by a TMA method according to JIS K7197, satisfy the following expressions (I) to (III):

0.5≤CTE.sub.MD/CTE.sub.TD≤1.5   (I)

0.10≤CTE.sub.MD/CTE.sub.Z≤1.00   (II)

0.10≤CTE.sub.TD/CTE.sub.Z≤1.00   (III).

For example, in an earphone in which left and right earphone units are connected by a cable and a remote part or a battery part is interposed on the cable, a bush structure is provided to a part where the cable is led out of the remote part and the like and suppresses the occurrence of disconnection in the vicinity of the lead-out part. The bush structure is provided to a lead-out part 5a of a cable 4 and includes a bush body 2 provided to the lead-out part and formed with a first through hole 2a2 where the cable is inserted. The first through hole gradually increases in diameter toward a lead-out direction of the cable.

For example, in an earphone in which left and right earphone units are connected by a cable and a remote part or a battery part is interposed on the cable, a bush structure is provided to a part where the cable is led out of the remote part and the like and suppresses the occurrence of disconnection in the vicinity of the lead-out part. The bush structure is provided to a lead-out part 5a of a cable 4 and includes a bush body 2 provided to the lead-out part and formed with a first through hole 2a2 where the cable is inserted. The first through hole gradually increases in diameter toward a lead-out direction of the cable.

A ceramic feedthrough assembly has a feedthrough interface sleeve brazed to a ceramic feedthrough body and a housing interface sleeve brazed to the feedthrough interface sleeve. The housing interface sleeve is configured to be integrated within an electronic device and welded to a metal housing to form a hermetically sealed electronic device. The ceramic feedthrough has at least one embedded electrical conductor extending from a first location on the ceramic feedthrough body to a second location on the ceramic feedthrough body. The feedthrough interface sleeve is positioned around the ceramic feedthrough body between the first location and the second location and brazed to the wrap-around metallization. When the metal housing is welded to the housing interface sleeve, the ceramic feedthrough assembly facilitates connection to an electronic circuit hermetically sealed in the electronic device with the metal housing.

A ceramic feedthrough assembly has a feedthrough interface sleeve brazed to a ceramic feedthrough body and a housing interface sleeve brazed to the feedthrough interface sleeve. The housing interface sleeve is configured to be integrated within an electronic device and welded to a metal housing to form a hermetically sealed electronic device. The ceramic feedthrough has at least one embedded electrical conductor extending from a first location on the ceramic feedthrough body to a second location on the ceramic feedthrough body. The feedthrough interface sleeve is positioned around the ceramic feedthrough body between the first location and the second location and brazed to the wrap-around metallization. When the metal housing is welded to the housing interface sleeve, the ceramic feedthrough assembly facilitates connection to an electronic circuit hermetically sealed in the electronic device with the metal housing.

The present invention relates to an electromagnetic shielding composite resin composition and a high-voltage shielded wire comprising the same. More particularly, the present invention relates to a high-voltage shielded wire comprising: a core composed of a conductive material; an insulation layer enveloping the core; an electromagnetic shielding layer surrounding the insulation layer and employing an electromagnetic shielding composite resin composition; and a coating layer covering the electromagnetic shielding layer and composed of an insulation material, wherein the electromagnetic shielding composite resin composition contains a thermoplastic resin, a metal-coated carbon fiber, carbon black, and a carbon nanofiber.

The present invention relates to an electromagnetic shielding composite resin composition and a high-voltage shielded wire comprising the same. More particularly, the present invention relates to a high-voltage shielded wire comprising: a core composed of a conductive material; an insulation layer enveloping the core; an electromagnetic shielding layer surrounding the insulation layer and employing an electromagnetic shielding composite resin composition; and a coating layer covering the electromagnetic shielding layer and composed of an insulation material, wherein the electromagnetic shielding composite resin composition contains a thermoplastic resin, a metal-coated carbon fiber, carbon black, and a carbon nanofiber.

A distribution member includes plural electric wire pairs each including a pair of electric wires, a first fixing member integrally fixing the electric wire pairs, and a second fixing member that is separated from the first fixing member and integrally fixes electric wires of at least one of the electric wire pairs. The first fixing member and the second fixing member each include a holder holding the electric wires and a resin mold part that includes a molding resin and is molded so as to cover a part of the electric wire pairs held by the holder. The holder includes at least one interposed part that is interposed between the held electric wires. The distribution member further includes a combining part that is integrally formed with the holders of the first and second fixing members and combines the holders of the first and second fixing members.