A power supply includes a metal case, a power conversion module and an insulation connecting plate. The power conversion module is arranged in the metal case and at interval with the metal case. The power conversion module includes a circuit board. The insulation connecting plate is respectively connected with the circuit board and the metal case. The insulation connecting plate is isolated between at least a portion of the circuit board and at least a portion of the metal case. A creepage distance between the metal case and a high voltage area of the circuit board are extended by the insulation connecting plate so as to fulfill the safety requirements.

Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.

Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.

A hybrid single or multilayer composite reinforcement system is disclosed. The system is configured to install or apply around the existing power transmission lines, for example, ACSR transmission lines for increasing ampacity and also decreasing sag of the power transmission lines. The hybrid composite system comprises a first layer, a second layer, and a composite core as a structural reinforcement component. The first layer and second layer are formed using a fiber reinforced resin composite material, comprising a basalt fiber and the structural reinforcement component is a carbon fiber. The composite core is disposed between the first layer and second layer. Further, the first layer and second layer are cured, thereby making the multilayer hybrid composite reinforcement system. The composite core, comprising for example carbon fiber, provides structural strength for the hybrid composite system. The system is novel, lightweight, fast and easy to install, long-lasting, reliable, environmentally friendly, and cost-effective.

Provided are a novel insulating material for a circuit substrate and a novel metal foil-clad laminate, and the like, in which the anisotropy of coefficients of linear thermal expansion in a MD direction, a TD direction, and a ZD direction is reduced. An insulating material for a circuit substrate, comprising a thermoplastic liquid crystal polymer film, wherein ratios of average coefficients of linear thermal expansion in a MD direction, a TD direction, and a thickness direction (CTE.sub.MD, CTE.sub.TD, CTE.sub.Z) at 23 to 200° C., as measured by a TMA method according to JIS K7197, satisfy the following expressions (I) to (III):

0.5≤CTE.sub.MD/CTE.sub.TD≤1.5   (I)

0.10≤CTE.sub.MD/CTE.sub.Z≤1.00   (II)

0.10≤CTE.sub.TD/CTE.sub.Z≤1.00   (III).

Provided are a novel insulating material for a circuit substrate and a novel metal foil-clad laminate, and the like, in which the anisotropy of coefficients of linear thermal expansion in a MD direction, a TD direction, and a ZD direction is reduced. An insulating material for a circuit substrate, comprising a thermoplastic liquid crystal polymer film, wherein ratios of average coefficients of linear thermal expansion in a MD direction, a TD direction, and a thickness direction (CTE.sub.MD, CTE.sub.TD, CTE.sub.Z) at 23 to 200° C., as measured by a TMA method according to JIS K7197, satisfy the following expressions (I) to (III):

0.5≤CTE.sub.MD/CTE.sub.TD≤1.5   (I)

0.10≤CTE.sub.MD/CTE.sub.Z≤1.00   (II)

0.10≤CTE.sub.TD/CTE.sub.Z≤1.00   (III).

Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.

Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.

The subject-matter of the invention is an electrical device comprising: a casing comprising a cavity receiving an electrical component, and at least two conductors connected to the electrical component so as to supply it with electric energy, both conductors being superimposed with each other and extending in parallel, said device being characterised in that it comprises an electric insulating film folded on itself around a fold, and a first part of which located on a side of the fold comes against a surface of the first conductor so as to electrically insulate it, and a second part of which located on the other side of the fold is inserted between both conductors so as to electrically insulate them from each other.

The subject-matter of the invention is an electrical device comprising: a casing comprising a cavity receiving an electrical component, and at least two conductors connected to the electrical component so as to supply it with electric energy, both conductors being superimposed with each other and extending in parallel, said device being characterised in that it comprises an electric insulating film folded on itself around a fold, and a first part of which located on a side of the fold comes against a surface of the first conductor so as to electrically insulate it, and a second part of which located on the other side of the fold is inserted between both conductors so as to electrically insulate them from each other.