The invention relates to a contamination protection device for high-voltage insulators and an arrangement consisting of the contamination protection device and a high-voltage insulator. The contamination protection device for high-voltage insulators according to the invention is designed to be mounted on the insulator cap of the high-voltage insulator and comprises for this purpose a mounting region, which is designed to be interlockingly connected to the insulator cap and comprises a through-opening for the connecting element of the insulator cap. A protective shield is furthermore provided, which extends radially around the mounting region in order to cover the high-voltage insulator. The arrangement comprises a high-voltage insulator with an insulator cap and a contamination protection device disposed on the insulator cap, wherein the contamination protection device is designed according to the invention and is connected to the insulator cap by means of an interlocking connection.

The invention relates to a contamination protection device (10) for high-voltage insulators (3), and to an assembly of a contamination protection device (10) and a high-voltage insulator (10). The contamination protection device (10) is designed for fastening to the insulator cap (5) of the high-voltage insulator (3) and has a protective shield (11), which extends radially around a feed-through opening (12) for the connection element (7) of the insulator cap (5), the feed-through opening (12) being surrounded, on the one side of the protective shield (11), by a fastening region (23) for interlocking connection to the insulator cap (5). On the other side of the protective shield (11), two eyes (14) for the insertion of a tab element (30) are provided and a tab element (30) is provided. The eyes (14) are arranged in such a way that the tab element (30) extends over the feed-through opening (12) after having been inserted

The invention relates to a contamination protection device (10) for high-voltage insulators (3), and to an assembly of a contamination protection device (10) and a high-voltage insulator (10). The contamination protection device (10) is designed for fastening to the insulator cap (5) of the high-voltage insulator (3) and has a protective shield (11), which extends radially around a feed-through opening (12) for the connection element (7) of the insulator cap (5), the feed-through opening (12) being surrounded, on the one side of the protective shield (11), by a fastening region (23) for interlocking connection to the insulator cap (5). On the other side of the protective shield (11), two eyes (14) for the insertion of a tab element (30) are provided and a tab element (30) is provided. The eyes (14) are arranged in such a way that the tab element (30) extends over the feed-through opening (12) after having been inserted

The invention relates to a contamination protection device (10) for high-voltage insulators (3), and to an assembly of a contamination protection device (10) and a high-voltage insulator (10). The contamination protection device (10) is designed for fastening to the insulator cap (5) of the high-voltage insulator (3) and has a protective shield (11), which extends radially around a feed-through opening (12) for the connection element (7) of the insulator cap (5), the feed-through opening (12) being surrounded, on the one side of the protective shield (11), by a fastening region (23) for interlocking connection to the insulator cap (5). On the other side of the protective shield (11), two eyes (14) for the insertion of a tab element (30) are provided and a tab element (30) is provided. The eyes (14) are arranged in such a way that the tab element (30) extends over the feed-through opening (12) after having been inserted

The invention relates to a contamination protection device (10) for high-voltage insulators (3), and to an assembly of a contamination protection device (10) and a high-voltage insulator (10). The contamination protection device (10) is designed for fastening to the insulator cap (5) of the high-voltage insulator (3) and has a protective shield (11), which extends radially around a feed-through opening (12) for the connection element (7) of the insulator cap (5), the feed-through opening (12) being surrounded, on the one side of the protective shield (11), by a fastening region (23) for interlocking connection to the insulator cap (5). On the other side of the protective shield (11), two eyes (14) for the insertion of a tab element (30) are provided and a tab element (30) is provided. The eyes (14) are arranged in such a way that the tab element (30) extends over the feed-through opening (12) after having been inserted

A metal base substrate including: a metal base; an insulation layer; and a circuit layer, the metal base, the insulation layer and the circuit layer being laminated in an order, wherein the insulation layer includes a resin, a film thickness of the circuit layer is in a range of 10 μm or more and 1000 μm or less, and a yield stress of the circuit layer is in a range of 10 MPa or more and 150 MPa or less.

A metal base substrate including: a metal base; an insulation layer; and a circuit layer, the metal base, the insulation layer and the circuit layer being laminated in an order, wherein the insulation layer includes a resin, a film thickness of the circuit layer is in a range of 10 μm or more and 1000 μm or less, and a yield stress of the circuit layer is in a range of 10 MPa or more and 150 MPa or less.

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

Disclosed are layered structures that include a polymeric layer and a varnish layer in contact with the polymeric layer, wires including the layered structures, and methods of making the layered structures. The polymeric layer includes a poly(ether ether ketone)(PEEK) and a poly(aryl ether sulfone) (PAES) and surprisingly exhibits markedly improved adhesion to the varnish layer without significant reduction in crystallization temperature of the polymeric layer.