A high-power resistor includes a substrate, a resistor layer, two edge electrodes, and a seed layer. The substrate has a first surface. The resistor layer is mounted on the first surface of the substrate. The two edge electrodes are mounted on the resistor layer. The seed layer is mounted between the resistor layer and the two edge electrodes. A contacting surface between one of the two edge electrodes and the resistor layer is bigger than contacting side surfaces of a printed resistor layer and printed conduction layers from a conventional chip resistor, creating less electrical resistance. When high-power electricity passes through the resistor layer, heat generated by a large passing current can be equally dissipated in all directions on the contact surface. With less electrical resistance and better heat dissipation, the contacting surface enables the high-power resistor to tolerate greater electric power.

A high-power resistor includes a substrate, a resistor layer, two edge electrodes, and a seed layer. The substrate has a first surface. The resistor layer is mounted on the first surface of the substrate. The two edge electrodes are mounted on the resistor layer. The seed layer is mounted between the resistor layer and the two edge electrodes. A contacting surface between one of the two edge electrodes and the resistor layer is bigger than contacting side surfaces of a printed resistor layer and printed conduction layers from a conventional chip resistor, creating less electrical resistance. When high-power electricity passes through the resistor layer, heat generated by a large passing current can be equally dissipated in all directions on the contact surface. With less electrical resistance and better heat dissipation, the contacting surface enables the high-power resistor to tolerate greater electric power.

A resistor includes a resistive element, an insulation plate, a protective film, and a pair of electrodes. The resistive element includes a first face and a second face arranged to face in opposite directions in a thickness direction. The insulation plate is on the first face, and the protective film on the second face. The electrodes are spaced apart in a first direction perpendicular to the thickness direction, and held in contact with the resistive element. Each electrode includes a bottom portion opposite to the insulation plate with respect to the resistive element in the thickness direction. Each bottom portion overlaps with a part of the protective film as viewed in the thickness direction. The resistor further includes a pair of intermediate layers spaced apart in the first direction. The intermediate layers are formed of a material electrically conductive and containing a synthetic resin. Each intermediate layer includes a cover portion covering a part of the protective film. The cover portion of each intermediate layer is disposed between the protective film and the bottom portion of one of the electrodes.

A resistor according to the present disclosure includes an insulated substrate, a resistive layer formed of a resistance body material and a bonding layer for bonding the insulated substrate and the resistive layer, wherein the resistor is configured so that a ratio of a sheet resistance of the bonding layer to a sheet resistance of the resistive layer is 100 or more.

A resistor according to the present disclosure includes an insulated substrate, a resistive layer formed of a resistance body material and a bonding layer for bonding the insulated substrate and the resistive layer, wherein the resistor is configured so that a ratio of a sheet resistance of the bonding layer to a sheet resistance of the resistive layer is 100 or more.

A shunt resistor module, which includes a shunt resistor having a resistor unit having a predetermined resistance, plate-shaped terminal units respectively configured to extend at both sides of the resistor unit, and a voltage measurement lead pin configured to protrude perpendicular to the terminal unit and having an end portion bent to be parallel to the terminal unit, and a PCB substrate having an assembly guide portion formed to be cut inward by a predetermined depth from an outermost side thereof. The voltage measurement lead pin is fit into the assembly guide portion so that the resistor unit and the terminal unit are placed on a front surface of the PCB substrate and the end portion of the voltage measurement lead pin is caught at a rear surface of the PCB substrate.

A surge arrester includes a polymer body or housing and a varistor assembly in the body or housing. The varistor assembly includes a plurality of varistor elements and a fuse electrically connected in series and forming a vertical stack of the plurality of varistor elements and the fuse. The stack has a first end surface, a second end surface, and a side surface extending between the first end surface and the second end surface. The varistor assembly includes a first end fitting at the first end surface of the stack and a second end fitting at the second end surface of the stack.

A surge arrester includes a polymer body or housing and a varistor assembly in the body or housing. The varistor assembly includes a plurality of varistor elements and a fuse electrically connected in series and forming a vertical stack of the plurality of varistor elements and the fuse. The stack has a first end surface, a second end surface, and a side surface extending between the first end surface and the second end surface. The varistor assembly includes a first end fitting at the first end surface of the stack and a second end fitting at the second end surface of the stack.

Particularly, it is an object to provide a circuit substrate that can reduce a field intensity near an electrode having a high potential. A circuit substrate of the present invention includes an insulated substrate, a thin-film resistive element, and electrodes electrically connected to both sides of the thin-film resistive element, the thin-film resistive element and the electrodes being disposed on a surface of the insulated substrate. The circuit substrate is characterized in that the thin-film resistive element has a pattern in which a resistance wire is repeatedly folded back, and a dummy wire for reducing a field intensity is provided on a high-potential electrode side.

A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.