A ceramic electronic component includes an electronic component body and portions of first and second metal terminals defined by lead wires covered with an outer resin material. The first metal terminal includes, connected in order, a first terminal joint portion, a first extension portion extending in a direction toward a mounting surface, and a first mount portion extending toward a side opposite to the electronic component body. The second metal terminal includes, connected in order, a second terminal joint portion, a second extension portion extending in the direction toward the mounting surface, and a second mount portion extending toward a side opposite to the electronic component body. The first and second mount portions respectively include first and second protruding bending portions protruding toward the mounting surface. The outer resin material includes a protruding portion protruding toward the mounting surface.

The present application addresses a method for establishing an electronic connection to an electronic component and a chip assembly. The method comprises the following steps. First, an electronic component having a first welding part is provided. Also a first electrical contact piece is provided. The first welding part and the first electrical contact piece are brought into mechanical contact with each other. Subsequently, while the mechanical contact is maintained, a welding current is applied which is capable of welding the electrical contact piece and the welding part together.

A resistor includes a substantially cylindrical resistive element having a resistance of less than about 1 m, a substantially cylindrical first termination electrically connected to the resistive element and a second termination electrically connected to the resistive element. The substantially cylindrical first termination is hollow to allow for accepting a connection such as from a battery cable. In addition there may be sense leads present on the resistor. A method of forming a substantially cylindrical resistor includes forming a hollow cylindrical resistor body by rolling a flat sheet comprising a resistive element and a first termination and a second termination joined on opposite ends of the resistive element.

A manufacturing method of shunt resistor according to the present invention includes a step of calculating a difference between an initial resistance value and a desired resistance value as a resistance value to be adjusted, a step of providing a plurality of recess forming members capable of forming recesses each having a characteristic size in the surface of a resistive alloy plate, a recess determining step of determining the size and the number of the recesses necessary to be formed at the surface of the resistive alloy plate, and a recess forming step of forming the recesses according to the size and the number determined in the recess determining step by using the corresponding recess forming members.

A resistor assembly can be used in a tap changer. The resistor assembly may include: a resistor element, which is held by at least two resistor holders; a base plate with at least one opening and on which the at least two resistor holders holding the resistor element are arranged; a plurality of guides, respectively formed in each of the resistor holders and being configured to position a first end and a second end of the resistor element with respect to a longitudinal direction between the two resistor holders; and contact points of the resistor element, the contact points being electrically contacted by contacts of the tap changer in a condition where the resistor element is inserted into the resistor holder.

Provided is a surface mount resistor that can be stably mounted without the need for lead wires to be to flattened. The surface mount resistor includes a first resistive element and a second resistive element arranged in parallel, the first resistive element having first lead wires at opposite ends thereof, and the second resistive element having second lead wires at opposite ends thereof. The first resistive element and the second resistive element are integrated by being covered with a sheath. The first lead wires and the second lead wires are arranged such that they protrude outward in a direction of an axis beyond the sheath. The first lead wires and the second lead wires are bent alongside surfaces and a bottom surface of the sheath.

Provided is a surface mount resistor that can be stably mounted without the need for lead wires to be to flattened. The surface mount resistor includes a first resistive element and a second resistive element arranged in parallel, the first resistive element having first lead wires at opposite ends thereof, and the second resistive element having second lead wires at opposite ends thereof. The first resistive element and the second resistive element are integrated by being covered with a sheath. The first lead wires and the second lead wires are arranged such that they protrude outward in a direction of an axis beyond the sheath. The first lead wires and the second lead wires are bent alongside surfaces and a bottom surface of the sheath.

A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.

A shunt resistor, at least a part of which has a resistive element with pre-set resistivity, is configured to bridge between two electrodes and detect a current value of a current flowing between the electrodes by detecting a voltage drop in the resistive element. The shunt resistor includes two connecting parts affixed to the electrodes via a conductive adhesive, respectively, and the connecting parts electrically connected to the affixed electrodes, a bridging part bridging between the connecting parts by being extended from one of the connecting parts to the other one of the connecting parts, and two bonding wires used to detect a voltage drop in the resistive element. The bonding wires are bonded to the bridging part.

Provided is a surface mount resistor that can be stably mounted without the need for lead wires to be to flattened. The surface mount resistor includes a first resistive element and a second resistive element arranged in parallel, the first resistive element having first lead wires at opposite ends thereof, and the second resistive element having second lead wires at opposite ends thereof. The first resistive element and the second resistive element are integrated by being covered with a sheath. The first lead wires and the second lead wires are arranged such that they protrude outward in a direction of an axis beyond the sheath. The first lead wires and the second lead wires are bent alongside surfaces and a bottom surface of the sheath.